Poster exhibition

The congress days will be accompanied by a large table-top exhibition including a poster presentation:

Poster Presentation:

  • New "Green" Tin-bronze Substitute Material for Connector Manufacturing
    Stephan Gross (Boway)

  • Single Pair Ethernet – From Standards to Application
    Frank Welzel (SPE Industrial Partner Network)

  • Driving Innovation for Field Installable Connectors, Shown by Integrating by a Wire Cutting Feature
    Tobias Leininger (TE Connectivity)

  • Alternatives to Cobalt in Hard Au Electrolytes
    Bernd Roelfs (Atotech)

  • Innovative Coatings for Electronic Connectors: Silver Alloys, Indium and Pure Gold
    Dr. Alphonse Foyet (Dupont)

  • Choosing the most suitable leak test method
    Dr. Joachim Lapsien (CETA Testsysteme)

  • How do digital twins simplify connector applications?
    Mike Knobel (Harting)

  • High-resolution insertion force measurement with new piezo sensors for tiny contact geometries and small forces
    Patrick Dudler (Kistler)

  • Basics of press-fit technology for high current applications
    Wladimir Werz (Würth eiSos)

  • Analysis, optimisation and verification of a high-voltage connector for e-mobility
    Dr. Thomas Gneiting (Admos), Bernd Mund (bda connectivity)

  • Aluminium as a connector material
    Dr. Benjamin Hertweck, Peter Sunkler (Hugo Kern und Liebers)


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Business Sponsors & Exhibitors