Poster exhibition
The congress days will be accompanied by a large table-top exhibition including a poster presentation:
Poster Presentation:
Poster Presentation:
- New "Green" Tin-bronze Substitute Material for Connector Manufacturing
Stephan Gross (Boway) - Single Pair Ethernet – From Standards to Application
Frank Welzel (SPE Industrial Partner Network) - Driving Innovation for Field Installable Connectors, Shown by Integrating by a Wire Cutting Feature
Tobias Leininger (TE Connectivity) - Alternatives to Cobalt in Hard Au Electrolytes
Bernd Roelfs (Atotech) - Innovative Coatings for Electronic Connectors: Silver Alloys, Indium and Pure Gold
Dr. Alphonse Foyet (Dupont) - Choosing the most suitable leak test method
Dr. Joachim Lapsien (CETA Testsysteme) - How do digital twins simplify connector applications?
Mike Knobel (Harting) - High-resolution insertion force measurement with new piezo sensors for tiny contact geometries and small forces
Patrick Dudler (Kistler) - Basics of press-fit technology for high current applications
Wladimir Werz (Würth eiSos) - Analysis, optimisation and verification of a high-voltage connector for e-mobility
Dr. Thomas Gneiting (Admos), Bernd Mund (bda connectivity) - Aluminium as a connector material
Dr. Benjamin Hertweck, Peter Sunkler (Hugo Kern und Liebers)
