Program 2020 *
Monday, September 7, 2020
Seminar block I
3:00 PM
Dr. Helmut Katzier studied communications engineering at the University of Applied Sciences Darmstadt and theoretical electrical engineering at the Technical University Darmstadt. Afterwards he was a research assistant at the Institute of Theoretical Electrical Engineering there for five years. After his doctorate, Dr. Katzier worked for Siemens AG in the Public Networks division. From 1 July 2006 to 29 February 2012, he worked for TietoEnator Deutschland GmbH and Tieto Embedded Systems GmbH. Since 1 March 2012 he has been working independently in the area of development, consulting and training. His diverse fields of activity include, among others, packaging and interconnection technology, especially in the areas of printed circuit boards, connectors and high-speed transmission technology. At the Technical Academy Esslingen, he leads the seminars connector technology, PCB technology, cables and wires, high-speed design of electronic assemblies and systems as well as the seminar EMC-compatible board and system design. He is also a speaker in the seminar Design of High-Frequency Circuits.
- Kontaktphysikalische Grundlagen des ruhenden Kontaktes
- Messung und Simulation von Kontaktoberflächen und Kontaktmaterialien
- Kontaktphysikalischer Vergleich von Standardoberflächen für Steckverbinder
- Kontakterwärmung und Derating
- Fretting- Korrosion
- Kontaktverhalten in Bezug auf Zwischenschichten
- Degradationsmechanismen von Steckverbinderkontakten
Das lernen die Teilnehmer im Vortrag:
- Grundlagen elektrischer Steckverbinderkontakte
- Einfluss der Beschichtung und der Basismaterialien
- Alterungs- und Ausfallmechanismen von Steckverbinderkontakten
12/2010 –: Leiter der Abteilung „Advanced Development of Terminals und Connectors“ (Vorausentwicklung) in der Businessunit Automotive weltweit bei TE Connectivity Germany GmbH, Arbeitsplatz in Bensheim und Speyer.
01/2007 – 11/2010: Leiter der Abteilung „Advanced Technology, Terminals und Connectors“ in der Entwicklung Automotive Europa bei Tyco Electronics AMP GmbH, Bensheim.
12/1999 – 12/2006: Leiter im Technologie-Marketing Bereich Automatisierungstechnik/Industrieelektronik bei Tyco Electronics AMP GmbH, Speyer
10/1996 – 11/1999: Leiter der Forschung und Vorfeldentwicklung (Advanced Technology) im Siemens Geschäftsbereich Elektromechanische Bauelemente (EC), Connectors und Sensors, Speyer.
11/1990 – 09/1996: Leitung verschiedener Fertigungsbereiche wie Galvanik, Handmontagelinien, Relaisfertigung, Stanzerei, Kunststoffspritzerei und Steckverbindermontage bei der Siemens AG EC in Speyer, mit Personalverantwortung bis zu 220 Mitarbeitern.
02/1988 – 09/1990: Wissenschaftlicher Mitarbeiter am „technologischen Zentrum für Oberflächenbehandlungsverfahren Leipzig“, Betriebsdelegierter an der TH-Ilmenau, mit Forschungsarbeiten zur computergestützten Überwachung saurer Kupferelektrolyte und Beizen.
01/1984 - 01/1988: Assistent an der TH- Ilmenau, Sektion Elektrotechnik, Bereich Elektrochemie und Galvanotechnik. Forschungen zur mikrorechnergestützten Erfassung der Grundbestandteile saurer Kupferelektrolyte, Erlangen der Dissertation 6/1988.
09/1979 – 12/1983: Studium der Elektrotechnik mit Vertiefungsrichtung Elektrochemie und Galvanotechnik an der TH-Ilmenau zum Abschluss als Diplomingenieur.
The many options available and the adaptability of the material solutions often overwhelm the user.
The aim of the tutorial is therefore on the one hand to present basic knowledge about copper & copper alloy materials available worldwide, but on the other hand also to give the experienced user details and correlations apart from data sheets and standards.
The following topics, among others, are addressed:
- Alloy overviews
- Hardening mechanisms of copper-based materials
- Natural hard & precipitation hardening copper materials
- Which characteristics are important for the design of connectors
- Material aspects of press-fit technology
- What exactly is stress relaxation
- Overview of hot-dip tinned strips
What you will learn:
- Basic knowledge of copper and copper alloys
- Background Info beyond the data sheets & brochures
For 29 years within the copper industry in various fields of activity (technical marketing, process engineering, quality and sales). After more than 28 years at Wieland-Werke AG, he has been working for Ningbo Powerway Alloy as Global Director Technical Marketing since 2020.
Seminar block II
4:50 PM
Dabei werden Grundlagen, Materialauswahl bei der Herstellung, physikalische Eigenheiten, Verarbeitungstechniken und die sich daraus ergebenden Zusammenhänge für Funktion und Anwendung erklärt.
In 14 Kapiteln werden detailliert die Unterschiede herausgestellt und die Vorteile und Nachteile der einzelnen Materialien und Fertigungs- und Anwendungsverfahren dargestellt, gegeneinander abgewogen und beurteilt.
Dabei werden sowohl die Einsatzgrenzen (Strombelastung bei höheren Umgebungstemperaturen) als auch das Verhalten bei höheren Datenraten behandelt.
Das lernen die Teilnehmer im Vortrag:
- Das Steckverbindarium soll kein Einkaufshelfer sein, sondern ein Kompendium der Vielfältigkeit von Eigenschaften, Bauformen und Verarbeitungsmöglichkeiten.
- Es zeigt herstellerunabhängig auf, welche Alternativen zur Verfügung stehen und was die Auswahl gewisser Eigenheiten zur Folge hat, im Guten und im Schlechten.
Herbert Endres studied communications engineering at the TH Nuremberg after completing his apprenticeship as a radio and television technician. He started his career as a project and sales engineer at AEG in Nuremberg and changed in 1975 as a product manager for capacitors at the component division of AEG Telefunken. After further positions at TRW and Labinal Components & Systems, he went to Molex in Heilbronn in January 1994 as senior product manager for telecommunication connectors worldwide. Since July 2017, he is working as a freelance consultant for questions relating to the connectors under the ConConsult logo.
Im theoretischen Teil werden neben einem historischen Rückblick auch die theoretischen Grundlagen und Gesetzmäßigkeiten der Galvanotechnik vermittelt. Einflüsse auf die Abscheidung und eine allgemeine Prozessfolge zur Beschichtung von Teilen mit Nickel und Gold runden die theoretischen Grundlagen ab. Für die Qualität der Beschichtung sind sehr viele Voraussetzungen des Grundmaterials, der Konstruktion und der Werkstoffwahl zu erfüllen. Diese werden ausführlich abgehandelt und neben der Oberflächenbeschaffenheit und den geometrischen Anforderungen des Grundwerkstoffs werden auch noch die Wechselwirkung von Grund- und Schichtwerkstoff vermittelt. Bei den Schichtwerkstoffen werden die Vor- und Nachteile der Metalle wie Gold, Palladium, Silber, Zinn, Weißbronze, Nickel und Kupfer als Kontaktmaterialien erörtert.
Die Verfahren der Einzelteilgalvanik, wie Trommel-, Vibrobot- und Gestellverfahren werden mit Hilfe von Filmen dargestellt und die Möglichkeiten der Beschichtung werden den Zuhörern anhand von Produktbeispielen näher gebracht. Die Selektivbeschichtung von Einzelteilen komplettiert das Portfolio der Beschichtung von Schüttgut.
Die Unterschiede und Vorteile der Bandgalvanik gegenüber der Einzelteilgalvanik bilden dann den Übergang zur Bandbeschichtung. Hier wird nochmals auf den besonderen Prozessablauf bei der Bandbeschichtung eingegangen und die verschiedenen Verfahren, wie Tauch-, Brush-, Streifen- und Spottechnik mit Hilfe von Filmen unter Anwendung verschiedener Selektivwerkzeuge erklärt.
Zusätzlich werden die verfahrensbedingten Toleranzen und Vorgaben der verschiedenen Techniken erläutert und durch Produktbeispiele abgerundet.
Im praktischen Teil werden Metallronden an unserer Kleingalvanisieranlage vergoldet. Hierbei werden die einzelnen notwendigen Prozessschritte wie Reinigen, Spülen, Aktivieren und Vergolden fachmännisch angewandt. Damit kann das im theoretischen Teil erlernte Fachwissen praktisch umgesetzt und vertieft werden.
- Grundlagen und Gesetzmäßigkeiten der Galvanotechnik
- Wechselwirkungen von Grund- und Beschichtungswerkstoff
- Verfahren
Tuesday, September 8, 2020
Verantwortliche Redakteurin Anwenderkongress Steckverbinder - ELEKTRONIKPRAXIS (Vogel Business Media)
What you will learn:
- The compendium offers a structured overview of many topics of digitization in the electrical industry.
- This roadmap supports companies in dealing with topics such as artificial intelligence, Industry 4.0 or cyber security.
- In addition to progress in the development of electronic components, it also takes into account software, material trends and aspects of manufacturing, as well as guidelines and laws and the corresponding fields of application.
After PhD in Solid State Physics (MPI für Strömungsforschung, Göttingen, Germany) Mr. Lock joined the sensor development center of Robert Bosch GmbH in Reutlingen. Mr. Lock held several positions in sensor development, electronics manufacturing, and ECU development and joined a JV with Hyundai Motors in Korea as head of the KEFICO Engineering & Technology Institute (KETI) for engine management ECUs. From 2011 till 2015 he was responsible for the innovation and technology management at Automotive Electronics division where he built up an innovation lab and introduced a technology management framework. Since 2016 he joined a corporate technology department as head for the Systems Engineering for E/E architectures and change end of 2018 to powertrains solutions for his current position as head of development for E7E architecture and Software Excellence.
What you will learn:
- Use cases for smart connectors with additional functions
- Development of a data model, service interfaces and state diagrams for the implementation of the additional functions
Andreas Huhmann studied physics and works as the strategy consultant for the HARTING Stiftung & Co.KG. As a board member of the manufacturer-independent technology initiative SmartFactoryKL e.V., he is involved in the implementation of Industry 4.0. In particular, the importance of intelligent connectivity for the modularization of production plants is a focus of his strategic work and the content of numerous publications and lectures.
After his diploma in electrical engineering with a focus on communications in 1997 and his Ph.D. in the field of numerical calculation of electromagnetic fields at the Technical University of Darmstadt in 2000, Dr. Michael Hilgner headed the development of a signal integrity and circuit simulation software at the company CST in Darmstadt. In 2008 he joined NOKIA, where he worked as a specialist for Electromagnetic Compatibility in the development of mobile devices at the location in Ulm. From 2010 to 2015, at the VDE in Frankfurt, Germany, he was responsible for the technical management of standards in various areas and also represented the German National Committee in steering groups and strategy committees of the IEC and CENELEC. Since 2015 he has been coordinating the engagements in consortia and standardization of TE Connectivity’s business unit “Industrial”.
The data models for automation components and their cabling created with this method form the basis for the efficient digital exchange across the value chain between manufacturers, trade organizations, manufacturers, electrical planners and end customers in a generally accepted modeling standard.
What you will learn:
- generic, manufacturer-neutral methodology for modeling electrical interfaces
Degree in electrical engineering, for more than 20 years at Murrelektronik GmbH in Oppenweiler with various tasks in the product development of fieldbus I/O modules
Main focus:
Hardware and software development,
Advanced development in automation technology,
Technical leadership and project management in the product development of automation components and functionally safe fieldbus I/O modules
existing Ethernet cabling. Single Pair Ethernet offers significant miniaturization while minimizing costs for future IIOT interfaces. Leading companies will show application areas and advantages of an internationally standardized cabling system. With the new SPE interface, device manufacturers can accommodate twice as many interfaces in the same installation space as before with conventional RJ45 jacks. The compact interface is also the only one that offers secure integration in M8 installations. This interface can therefore very easily complement existing infrastructures and fully develop its cost-saving potential.
What you will learn:
- Applications for Single Pair Ethernet in industrial environments
- Advantages of an internationally standardized Single Pair Ethernet interface
- Status of international standardization for Single Pair Ethernet
After studying at the University of Applied Sciences in Bielefeld (Germany) and the Université de Metz in France with a focus on mechanics and structural analysis, Simon Seereiner began his career in 1998 at Harting in the field of printed circuit board connector development. Within the Harting Technology Group, Mr. Seereiner went through various departments, most recently as market manager responsible for the area of industrial communication. Since 2005, Simon Seereiner has been the Portfolio Manager for Passive Ethernet and Sensor & Actuator Interfaces at Weidmueller Interface GmbH & Co. KG. The focus of his activities is the global expansion of the portfolio for passive industrial networking products. Mr. Seereiner has been actively involved in various national and international committees for connector standardization.
What you will learn:
- 1. An industrial SPE connector is standardized with separate power contacts that can handle currents up to 8 A
- 2. The importance of shielding between the power and data contacts to maintain proper data integrity
- 3. Power transfer depends on cable choice
Wijnand van Gils MSc studied Electrical Engineering at the Technical University Eindhoven in the Netherlands with as specialization electromagnetics. In 2007 he started as antenna engineer at TE Connectivity in Den Bosch, the Netherlands. He designed integrated antennas for among others mobile phones, routers and cars. Later on the focus shifted to signal integrity in connector designs. Since 2016 he works for TE Connectivity as principal R&D engineer on connector developments for Ethernet applications used in industrial environments.
In this lecture the basics of 10BASE-T1L are explained and corresponding products are shown, which are also relevant for the selection of suitable connectors in different applications.
What you will learn:
- Basics of 10BASE-T1L
- Switching to the new standard
Thomas Brand started working for Analog Devices in Munich in October 2015 as part of his master's thesis. From May 2016 to January 2017, he was part of a trainee program for field application engineers at Analog Devices, after which he moved to the role of field application engineer in February 2017 and has since then mainly been responsible for major industrial customers. He initially studied electrical engineering at the Duale Hochschule Mosbach before completing his postgraduate studies in international sales at the Hochschule für Technik, Wirtschaft und Gestaltung in Konstanz with a master's degree.
Thomas Tzscheetzsch has been working at Analog Devices as a Staff Field Applications Engineer since 2010. From 2010 to 2012 he was responsible for the regional customer support, since 2012 he has worked intensively in a key account team on a smaller customer base. After the reorganization, he leads a team of FAEs in the IHC cluster as Senior FAE Manager.
Workshop block I
2:00 PM
- What is Low Pressure Moulding - classification and differentiation from other technologies.
- How to assess the feasibility of a project - presentation of the general conditions, parameters etc.
3. Challenges and developments
On the basis of the presented framework conditions for the assessment of the feasibility, specific challenges are highlighted and how these can be solved. This also deals specifically with developments within the technology
- Tools - how can project-specific requirements be realized in the tool design
- Machine technology - which solutions offer flexible machine systems
- Materials - Use of moulding materials with different properties for optimal project results
What you will learn:
- Basics and areas of application of Low Pressure Moulding
- Parameters and typical challenges of the technology
- Approaches to implement a wide range of projects
Ciprian Stein * October 17, 1983
- Qualification as mechatronics engineer with subsequent further training as state-certified technician specializing in development and construction
- Employed at OptiMel since 2012 - initially as designer, now as project manager and in technical sales
If no high demands are placed on the tightness, a form-fit overmoulding may be sufficient. If higher demands are made, a substance-to-substance bond should be aimed for.
If a cable is to be overmoulded tightly, new limitations arise due to the required process pres-sures and temperatures. Here too, a specific material selection must be made.
What you will learn:
- Understanding of the material plastic
- General problems in multi-component injection moulding
- Special challenges in cable overmoulding
Andreas Wortmann studied production engineering at the University of Applied Sciences Südwestfalen, Iserlohn, and has been working at the Kunststoff-Institut Lüdenscheid since the beginning of 2011. In his field of activity, he deals with the topics of "media-tight overmoulding" and the testing of components with regard to their tightness (IP tests, differential pressure measurement, etc.).
Starting with the theoretical principles and laws of electroplating, the effects of various parameters on the deposition and the process sequence of an electrolytic deposition are discussed below. For a high-quality coating, certain specifications of the base material, such as the surface quality, the design, and the choice of materials, must be met. These are discussed in detail and the dependency on base and layer material is also conveyed. The coating metals available today are shown, and the advantages and disadvantages of the individual metals and alloys are presented.
What you will learn:
- basic knowledge of electroplating
Sales Manager Gerweck GmbH Oberflächentechnik
- 1983 to 1987 study of chemistry in Mannheim
- 1988 to 2000 W. C. Heraeus GmbH in Hanau
Employee / Head of Electroplating Laboratory,
Support of electroplating department, research and development with patent applications
- 2001 to 2007 Heimerle + Meule GmbH in Pforzheim
Business Unit and Sales Manager
Sales of chemicals and devices for electroplating
- 2008 to 2010 Prym Inovan GmbH in Pforzheim
Business Unit Manager Surface Technology
- 2010 to 2020 IMO Oberflächentechnik GmbH
Sales Manager
Sales of coatings for the contact industry
- Since February 2020 Gerweck GmbH Oberflächentechnik
Sales Manager
Sales of coatings for the contact industry
-
What you will learn:
- Common crimp connections; advantages and disadvantages
- requirements for crimp connections; references to standards
- selected test methods
Managing director and owner of a cable assembly company with more than 50 years of professional experience. After retirement and transfer of the company, he has been managing director of a consulting company for several years. Occupation: Telecommunications mechanic, studied communications engineering, worked for international standardization of crimp connections. Master trainer for international qualification of crimp connections according to IPC/WHMA-A-620. Author and trainer for courses of a documentation about the practice of cable assembly.
What you will learn:
- Application-specific selection of connectors
- Vulnerabilities of RJ45 connectors
- Optimization of RJ45 connectors
Tim Kindermann is been working at Phoenix Contact since 2010 and responsible for copper-based data connectors since 2014 as a product manager in the Business Unit of Field Device Connectors. In this area, he is responsible for RJ45 Jack modules, Patch Panels and connectors for future Single Pair Ethernet applications.
What you will learn:
- Advantages of Single Pair Ethernet cabling soutions
- Integrity in existing cabling systems
- Potential for Single Pair Ethernet
Dipl.-Wirt.-Ing. Verena Neuhaus arbeitet seit 2006 bei Phoenix Contact und ist seit 2013 verantwortlich für das Produktmanagement für Datensteckverbinder. In diesem Bereich verantwortet sie Steckverbinder, Patchkabel und Infrastrukturkomponenten für die Datenkommunikation im Bereich der Kupfer- und LWL-Verkabelung.
The question is: How to bring DFMEA to the next level?
In order to answer we will have to perform a detailed functional analysis, look for a FMEA software to help us and look for a better indicator than the famous Risk Priority Number (RPN).
Das lernen die Teilnehmer im Vortrag:
- How to perform a detailed functional analysis
- The advantages of a FMEA software over a spreadsheet
- The advantages of a matrix rating over the Risk Priority Number
Baptiste Babeau, holder of a technical degree and an engineering degree in Mechanical engineering, worked 3 years in the automotive industry for Valeo on the design of a new Start & Stop starter. He performed, among others missions, the functional analysis and the DFMEA of this product with the cutting edge requirements of the automotive industry. He joined Würth Elektronik in 2018 to manage at international scale the Wire To Board products portfolio and to be responsible for the DFMEAs of the Würth Elektronik connectors.
In IP protection class testing, type samples or prototypes are tested in the laboratory according to the required IP protection class. This is therefore a type test.
If there is a requirement to deliver each product tested, a routine test is necessary. Here, the leak test must be integrated into the production process as an end-of-line test.
Based on the principles of leak testing, a practical guide to leak testing of different types of connectors is presented. This is supplemented by a large number of practical tips for the practical implementation of leak testing as well as an overview of how to optimize the testing process
What you will learn:
- IP protection classes for water tests / type testing versus routine testing
- Leak test during production with compressed air / adaptation of connectors
- Practical examples / practical tips / optimisation possibilities / FAQ
Dr. Joachim Lapsien studied physics at the Heinrich-Heine-University of Düsseldorf with a focus on laser and plasma physics. He received his doctorate in the field of optical metrology. Since 2003 he has been working for CETA Testsysteme GmbH, Hilden, in the field of industrial leak and flow testing. He heads the sales department and is head of the DAkkS calibration laboratory. Dr. Lapsien is a regular speaker on industrial leak and flow testing with presentations (lectures, posters, workshops) at national and international conferences (e.g. AMA Conference, World Conference of Non-Destructive Testing, DGzfP technical seminars on leak testing, connector congress, Innosecure, Cooling Days). He has also published various articles in relevant technical journals and books.
To save time and expensive design changes, individual components and modules should undergo EMC testing to verify their functionality in target application environments, prior to final assembly.
The module’s requirements can be applied to its connecting elements accordingly. A possible description of EMC properties in a connector can be provided by the coupling inductivity, which this lecture will examine in detail.
What will you learn:
- What is coupling inductivity and how to measure it?
- Which constructive challenges have to be faced when developing a shielded connector?
- How do shielded and unshielded connectors compare in practice?
Carsten Stange, Dipl. Ing. Graduate engineer Carsten Stange successfully completed his electrical engineering degree at the technical university in Dresden. Since 2008, he’s been a design engineer at Langer EMV-Technik GmbH as part of research and development in the field of electro magnetic tolerance. He focuses on near field scanning of assemblies and switching circuits, the implementation of susceptibility tests as well as device development and the qualification of connectors.
Stefan Frömmrich, Dipl. Ing. Graduate engineer Stefan Frömmrich studied mechanical engineering at the Kempten University of Applied Sciences. He wrote his graduate thesis in cooperation with ept GmbH covering the mechanical properties of printed circuit boards for press-fit technology. Stefan Frömmrich has been working as a design engineer in pre-development of PCB connectors at ept GmbH since April 2014. As a project manager he’s responsible for development and qualification of new connectors and processes and represents ept in several international committees.
However, this does not make sensible use of valuable space on the back of the board and the idea of surface mounted solutions, i.e. products placed and soldered on one side only, was developing.
Combined with the risk that the connection is only electrically and mechanically connected via the soldering point and therfore any error, especially if the board is only slightly contaminated,
could lead to poor connection and thus also to unstable mechanical adhesion of the component.
From this WECO developed the Floating Elements Technology, in which components have the property to adapt to the surface, its mechanical deformation with temperature differences and with different melting.
What you will learn:
- Floating Elements are the future
-
Detlef Fritsch, born 1960, started his career as an officer in the German Bundeswehr and completed his university studies in electrical engineering. 1991 he started in the sales department of data communication technology. He grew up as sales manager at AEG Lichttechnik GmbH/ Philips and then assumed global responsibility for lighting solutions in the automotive industry as head of key account. Since 2016 he is responsible for the EMEIA division as Managing Director at WECO Contact GmbH.
Various methods are available for quality control or failure analysis.
In addition to non-destructive testing, such as layer thickness measurements, analyses of the quantitative material composition via XRF or contact resistance measurements, destructive analyses, e.g. microsectioning for a SEM-EDX analysis or spatially-resolved hardness measurements, can also be peformed.
A further aspect is the performance of life- and environmental tests.
Some of these methods are explained and illustrated by practical examples.
Furthermore, it will be shown how long-term storage of critical components can be used to solve the problem of insufficient availability of spare parts.
What you will learn:
- Various methods for quality control or failure analysis of connectors
- Solution to the problem of insufficient availability of spare parts due to the constantly increasing number of discontinued components
Studies in Electrical Engineering (communications engineering) at TU Dortmund University,
1994 to 2001: Co. for hardware and software development of microcontroller circuits and quality management,
since 2001: Technical Director of the test house HTV-GmbH in Bensheim as Managing Director –Technical Operations
Verantwortliche Redakteurin Anwenderkongress Steckverbinder - ELEKTRONIKPRAXIS (Vogel Business Media)
Workshop block II
6:10 PM
- What is Low Pressure Moulding - classification and differentiation from other technologies.
- How to assess the feasibility of a project - presentation of the general conditions, parameters etc.
3. Challenges and developments
On the basis of the presented framework conditions for the assessment of the feasibility, specific challenges are highlighted and how these can be solved. This also deals specifically with developments within the technology
- Tools - how can project-specific requirements be realized in the tool design
- Machine technology - which solutions offer flexible machine systems
- Materials - Use of moulding materials with different properties for optimal project results
What you will learn:
- Basics and areas of application of Low Pressure Moulding
- Parameters and typical challenges of the technology
- Approaches to implement a wide range of projects
Ciprian Stein * October 17, 1983
- Qualification as mechatronics engineer with subsequent further training as state-certified technician specializing in development and construction
- Employed at OptiMel since 2012 - initially as designer, now as project manager and in technical sales
If no high demands are placed on the tightness, a form-fit overmoulding may be sufficient. If higher demands are made, a substance-to-substance bond should be aimed for.
If a cable is to be overmoulded tightly, new limitations arise due to the required process pres-sures and temperatures. Here too, a specific material selection must be made.
What you will learn:
- Understanding of the material plastic
- General problems in multi-component injection moulding
- Special challenges in cable overmoulding
Andreas Wortmann studied production engineering at the University of Applied Sciences Südwestfalen, Iserlohn, and has been working at the Kunststoff-Institut Lüdenscheid since the beginning of 2011. In his field of activity, he deals with the topics of "media-tight overmoulding" and the testing of components with regard to their tightness (IP tests, differential pressure measurement, etc.).
Starting with the theoretical principles and laws of electroplating, the effects of various parameters on the deposition and the process sequence of an electrolytic deposition are discussed below. For a high-quality coating, certain specifications of the base material, such as the surface quality, the design, and the choice of materials, must be met. These are discussed in detail and the dependency on base and layer material is also conveyed. The coating metals available today are shown, and the advantages and disadvantages of the individual metals and alloys are presented.
What you will learn:
- basic knowledge of electroplating
Sales Manager Gerweck GmbH Oberflächentechnik
- 1983 to 1987 study of chemistry in Mannheim
- 1988 to 2000 W. C. Heraeus GmbH in Hanau
Employee / Head of Electroplating Laboratory,
Support of electroplating department, research and development with patent applications
- 2001 to 2007 Heimerle + Meule GmbH in Pforzheim
Business Unit and Sales Manager
Sales of chemicals and devices for electroplating
- 2008 to 2010 Prym Inovan GmbH in Pforzheim
Business Unit Manager Surface Technology
- 2010 to 2020 IMO Oberflächentechnik GmbH
Sales Manager
Sales of coatings for the contact industry
- Since February 2020 Gerweck GmbH Oberflächentechnik
Sales Manager
Sales of coatings for the contact industry
-
What you will learn:
- Common crimp connections; advantages and disadvantages
- requirements for crimp connections; references to standards
- selected test methods
Managing director and owner of a cable assembly company with more than 50 years of professional experience. After retirement and transfer of the company, he has been managing director of a consulting company for several years. Occupation: Telecommunications mechanic, studied communications engineering, worked for international standardization of crimp connections. Master trainer for international qualification of crimp connections according to IPC/WHMA-A-620. Author and trainer for courses of a documentation about the practice of cable assembly.
What you will learn:
- Application-specific selection of connectors
- Vulnerabilities of RJ45 connectors
- Optimization of RJ45 connectors
Tim Kindermann is been working at Phoenix Contact since 2010 and responsible for copper-based data connectors since 2014 as a product manager in the Business Unit of Field Device Connectors. In this area, he is responsible for RJ45 Jack modules, Patch Panels and connectors for future Single Pair Ethernet applications.
What you will learn:
- Advantages of Single Pair Ethernet cabling soutions
- Integrity in existing cabling systems
- Potential for Single Pair Ethernet
Dipl.-Wirt.-Ing. Verena Neuhaus arbeitet seit 2006 bei Phoenix Contact und ist seit 2013 verantwortlich für das Produktmanagement für Datensteckverbinder. In diesem Bereich verantwortet sie Steckverbinder, Patchkabel und Infrastrukturkomponenten für die Datenkommunikation im Bereich der Kupfer- und LWL-Verkabelung.
The question is: How to bring DFMEA to the next level?
In order to answer we will have to perform a detailed functional analysis, look for a FMEA software to help us and look for a better indicator than the famous Risk Priority Number (RPN).
Das lernen die Teilnehmer im Vortrag:
- How to perform a detailed functional analysis
- The advantages of a FMEA software over a spreadsheet
- The advantages of a matrix rating over the Risk Priority Number
Baptiste Babeau, holder of a technical degree and an engineering degree in Mechanical engineering, worked 3 years in the automotive industry for Valeo on the design of a new Start & Stop starter. He performed, among others missions, the functional analysis and the DFMEA of this product with the cutting edge requirements of the automotive industry. He joined Würth Elektronik in 2018 to manage at international scale the Wire To Board products portfolio and to be responsible for the DFMEAs of the Würth Elektronik connectors.
In IP protection class testing, type samples or prototypes are tested in the laboratory according to the required IP protection class. This is therefore a type test.
If there is a requirement to deliver each product tested, a routine test is necessary. Here, the leak test must be integrated into the production process as an end-of-line test.
Based on the principles of leak testing, a practical guide to leak testing of different types of connectors is presented. This is supplemented by a large number of practical tips for the practical implementation of leak testing as well as an overview of how to optimize the testing process
What you will learn:
- IP protection classes for water tests / type testing versus routine testing
- Leak test during production with compressed air / adaptation of connectors
- Practical examples / practical tips / optimisation possibilities / FAQ
Dr. Joachim Lapsien studied physics at the Heinrich-Heine-University of Düsseldorf with a focus on laser and plasma physics. He received his doctorate in the field of optical metrology. Since 2003 he has been working for CETA Testsysteme GmbH, Hilden, in the field of industrial leak and flow testing. He heads the sales department and is head of the DAkkS calibration laboratory. Dr. Lapsien is a regular speaker on industrial leak and flow testing with presentations (lectures, posters, workshops) at national and international conferences (e.g. AMA Conference, World Conference of Non-Destructive Testing, DGzfP technical seminars on leak testing, connector congress, Innosecure, Cooling Days). He has also published various articles in relevant technical journals and books.
Wednesday, September 9, 2020
Solid brass turned parts are replaced with hybrid combinations of specialized functional materials. The conductivity characteristics, adhesive strength and scratch resistance of such layers were analyzed in extensive tests.
A positive feasibility study by the University of Cologne suggests to structure the entire process chain, from the unmachined part to the coated pin, in-house to facilitate efficient process control.
By optimizing the process parameters, high-current plasma polishing, the drying process and various PVD variables, the contact elements are protected by a higher-density, efficiently bonded and crystalline precious metal layer.
- PVD gold plating to prevent corrosion
- High-current plasma polishing for perfect pre-cleaning
- Mono-layer conductors through additive PVD technology
After obtaining a boarding school leaving certificate, Wolfgang B. Thörner completed his studies as a Wholesale and Export Merchant. He spent 8 years working as a buyer and then 5 years as assistant to the Purchasing Director with the automobile manufacturer Karmann in Osnabrück. This is where he gained his extensive technical knowledge. At the same time, he also completed a second college degree as an Industrial Clerk and student of Business Management (FH) and obtained a certificate qualifying him for entry to a specialist university. But before he was able to take up his university studies in Psychology, his electrotechnical hobby enabled him to develop a connector, purely by chance. This soon led to his first patent and then to the founding of WBT-Industrie GmbH in 1985.
- thinner wall thicknesses.
- tighter tolerances.
- higher surface quality.
- Shortening the casting runners.
- Servo drives for better process control.
- Development of the hot chamber multi-slide technology for aluminum.
What you will learn:
- Function and areas of application of multi-slide die casting technology.
- Latest developments in multi-slide die casting technology.
- Expanded design options for castings with regard to geometries and tolerances.
1990-1995 Studied mechanical engineering / University of Stuttgart
1995-2000 Designer / machines and plants
2000-2006 Head of Engineering / Automotive Supplier / forming technology
2007-2010 BU-Manager / Special Machine Construction / plastic welding machines
2010-2015 Director Business Development / electromagnetic devices
since 2016 General Manager / Dynacast Germany / precision die casting
With a special copper alloy, it was initially possible to produce inductors of the highest quality. Today, 100% pure copper can also be processed using 3D printing.
Zinc opens up a further interesting field of application. Components made of the zinc alloy Zamak 5 for zinc die casting are widely used. We have now succeeded in developing a process for additive layer processing of the series material Zamak 5. Prototypes as well as small series are thus produced at a low component price.
What Will You Learn:
- Advantages of additive manufacturing
- Innovative materials for additive manufacturing
- Economical 3D printing for the production of connectors
Stefan de Groot started studying industrial engineering at the University of Paderborn in October 2010. After five years, he finished his studies as Master of Science and started working for the Direct Manufacturing Research Center in November 2015. The DMRC is an institute for additive manufacturing of the University of Paderborn, where Stefan de Groot was responsible for the laboratories and worked on scientific projects. Since August 2016, he is working at the Phoenix Contact GmbH & Co. KG, including the transition to the PROTIQ GmbH as independent subsidiary in December 2016, and acts there as project and technology manager for additive manufacturing.
Verantwortliche Redakteurin Anwenderkongress Steckverbinder - ELEKTRONIKPRAXIS (Vogel Business Media)
Poster Presentation:
- New "Green" Tin-bronze Substitute Material for Connector Manufacturing
Stephan Gross (Boway) - Single Pair Ethernet – From Standards to Application
Frank Welzel (SPE Industrial Partner Network) - Driving Innovation for Field Installable Connectors, Shown by Integrating by a Wire Cutting Feature
Tobias Leininger (TE Connectivity) - Alternatives to Cobalt in Hard Au Electrolytes
Bernd Roelfs (Atotech) - Innovative Coatings for Electronic Connectors: Silver Alloys, Indium and Pure Gold
Dr. Alphonse Foyet (Dupont) - Auswahl des geeigneten Dichtheitsprüfprozesses
Dr. Joachim Lapsien (CETA Testsysteme) - Alternative silver based high temperature resistant corrosion protection
Gerald Metge (Inovan)
