Program

Tuesday, September 7, 2021

10:00 AM
SPE-Day

Registration
10:55 AM
Welcome Address
Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS
11:00 AM
"Quo vadis Single Pair Ethernet" - News from the SPE World and a critical Review of Possible Applications in the Industry more
With the IEEE 802.3 SPE transmission standards now available, speeds of 10 Mbit/s over long distances and 10 Gbit/s over short distances are feasible. The presentation highlights the resulting requirements on the interconnection technology, especially the RF requirements up to bandwidths in the GHz range. SPE will conquer many application fields in the future. However, an essential point besides the advantage of SPE with its continuous IP communication is the question of power supply. The main market requirement here, especially for sensor networks, is a cable with an interface. The standard answer to the issue of remote power supply is usually Power over DataLine (PoDL). But is this the most favorable solution or are hybrid interfaces not perhaps the better solution?

The participants learn in the lecture:
  • Status of relevant standardization for SPE at IEEE 802.3, IEC 63171-x and for cabling and interconnect requirements
  • Industrial applications and considerations for the simultaneous transmission of SPE and the power supply
  • Outlook and further development of SPE especially at IEEE 802.3

Speaker: Matthias Fritsche | Harting

Matthias Fritsche studied electrical engineering at the Technical University of Ilmenau and has been working at HARTING in Espelkamp as a product manager for Ethernet data connectors and cabling systems since 2006. In his role as Senior Expert Ethernet Connectivity, he is a member of various Industrial Ethernet user groups such as PNO for PROFINET, ODVA for Ethernet/IP, ETG for EtherCAT, VNO for Varan as well as standards committees at IEC and TIA. Since 2015, he has been active in the IEEE 802.3 (Ethernet working group), where he is helping to drive forward standards for new transmission methods such as single pair Ethernet, remote powering, etc.

11:30 AM
Use Cases for Single Pair Ethernet: The Advantages of SPE in industrial Communication more
The increasing degree of digitalisation in industrial plants requires the further development of existing Ethernet cabling. Single Pair Ethernet offers significant miniaturization while minimizing costs for future IIOT interfaces. Leading companies will show application areas and advantages of an internationally standardized cabling system. With the new SPE interface, device manufacturers can accommodate twice as many interfaces in the same installation space as before with conventional RJ45 jacks. The compact interface is also the only one that offers secure integration in M8 installations. This interface can therefore very easily complement existing infrastructures and fully develop its cost-saving potential.

The participants learn in the lecture:
  • Applications for Single Pair Ethernet in industrial environments
  • Advantages of an internationally standardized Single Pair Ethernet interface
  • Status of international standardization for Single Pair Ethernet
Speaker: Simon Seereiner | Weidmüller

After studying at the University of Applied Sciences in Bielefeld (Germany) and the Université de Metz in France with a focus on mechanics and structural analysis, Simon Seereiner began his career in 1998 at Harting in the field of printed circuit board connector development. Within the Harting Technology Group, Mr. Seereiner went through various departments, most recently as market manager responsible for the area of industrial communication. Since 2005, Simon Seereiner has been the Portfolio Manager for Passive Ethernet and Sensor & Actuator Interfaces at Weidmueller Interface GmbH & Co. KG. The focus of his activities is the global expansion of the portfolio for passive industrial networking products. Mr. Seereiner has been actively involved in various national and international committees for connector standardization.

Speaker: Verena Neuhaus | Phoenix Contact

Dipl.-Wirt.-Ing. Verena Neuhaus arbeitet seit 2006 bei Phoenix Contact und ist seit 2013 verantwortlich für das Produktmanagement für Datensteckverbinder. In diesem Bereich verantwortet sie Steckverbinder, Patchkabel und Infrastrukturkomponenten für die Datenkommunikation im Bereich der Kupfer- und LWL-Verkabelung.

12:00 PM
Coffee Break and Exhibition
12:30 PM
High Power Levels for Single Pair Ethernet (engl.) more
An SPE connector is introduced that is designed for industrial environments with two pin pairs where one is used for data transmission up to 1 Gbps/600 MHz as defined by IEEE 802.3bp and the other one supports power transmission with currents up to 8 A. This connector is standardized in IEC 63171-6 together with a variant without an extra power pair, which was published on the 20th of January 2020. The hybrid connector with a data and power pin pair features a metal shield separating the pin pairs to avoid the interference of the power signal with the data signal. This all is placed within the form factor of an M8 connector what leads to the challenge of avoiding that higher harmonics from the power transmission, like from switch mode power supplies, do not significantly deteriorate the data transmission.

The participants learn in the lecture:
  • An industrial SPE connector is standardized with separate power contacts that can handle currents up to 8 A
  • The importance of shielding between the power and data contacts to maintain proper data integrity
  • Possible network topologies with a hybrid connector
Speaker: Wijnand van Gils | TE Connectivity

Wijnand van Gils MSc studied Electrical Engineering at the Technical University Eindhoven in the Netherlands with as specialization electromagnetics. In 2007 he started as antenna engineer at TE Connectivity in Den Bosch, the Netherlands. He designed integrated antennas for among others mobile phones, routers and cars. Later on the focus shifted to signal integrity in connector designs. Since 2016 he works for TE Connectivity as principal R&D engineer on connector developments for Ethernet applications used in industrial environments.

1:00 PM
The new Standard 10BASE-T1L – Everything the Same? more
Driven by the trend of Industry 4.0, the communication landscape in process automation is changing toward integrated networks, supporting connectivity across the entire factory. Data needs to be obtained from the machines of the operational technology (OT), processed and then transferred to computer systems at the enterprise level (IT) for further processing. Here, Ethernet is crystallizing as the communication standard, with various Ethernet technologies available. For example, the new Ethernet standard 10BASE-T1L, a two-wire Ethernet solution for line lengths up to 1700m at a transmission speed of 10 Mbit/s, which supports protocols such as Profibus, PROFINET, Modbus, etc., is suitable as a replacement for previous 4 to 20mA or fieldbus applications. This offers the possibility to continue using existing wiring and thus protect investments.  In this presentation, the basics of 10BASE-T1L will be explained as well as corresponding products will be shown, which are also relevant for the selection of suitable connectors in various applications, including power transmission.

The participants learn in the lecture:
  • Basics of 10Base-T1L
  • Power over Data Line
  • Applications

Speaker: Thomas Tzscheetzsch  | Analog Devices

Thomas Tzscheetzsch joined Analog Devices in 2010 working as Senior Field Applications Engineer. From 2010 until 2012 he covered the regional customer base in the middle of Germany, since 2012 he is working in a Key Account Team on a smaller customer base. After the reorganization in 2017 he’s leading a team of FAEs in the IHC Cluster as Senior Field Technical Leader.

1:30 PM
Possible and available SPE PHYs and switches more
In this lecture we give an overview of the available PHYs and switches from our EBV line card for SPE. We also present the associated Eval boards and also demonstrators from third parties. Furthermore, we will also present the corresponding passive components from our sister company Avnet Abacus. This rounds off the system solution on the circuit board.
Speaker: Karl Lehnhoff | EBV Elektronik

Karl has been working for EBV Elektronik since 2008. From 2008 to 2011 he was regional application manager responsible for the CE-NW region. In 2011 he took over the Renewable Energies segment as director and developed it further. Today this segment is called City & Infrastructure. In March 2019, he moved to the Industrial segment as Director. Before joining EBV Elektronik, he held various positions in electronics development, as an application engineer and account manager in sales. Karl studied electrical engineering with a focus on communications engineering at the Dortmund University of Applied Sciences and is a graduate engineer.

2:00 PM
SPE Sensor Technology
Speaker: Frank Moritz | Sick
2:30 PM
Hybrid sensor cabling with Single Pair Ethernet more

The new single pair ethernet (SPE) standard is taking the network of things all the way to the sensor. An essential requirement is to supply the sensor with power. In the first part of the presentation, the hybrid SPE cabling will be introduced and what special features exist compared to the other possible SPE variants, e.g. Power over Dataline (PoDL). The effects will be discussed in particular with regard to electrical safety, EMC, but also cabling topologies. This will be followed by a small live demonstration of hybrid sensor/actuator cabling.

This will be followed by a discussion on how this cabling system can be further improved by thinking of the connector as an integral part of the electronic system and no longer limited to the electromechanical role.

Speaker: Dr. Karsten Walther | Perinet
3:00 PM
Final Discussion
Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS

Basic Seminar A

3:10 PM

3.10 - 4.40 pm
Connectors - important characteristic values and terms more
In the field of electrical connectors, many terms from different disciplines are used, the exact knowledge of which is of great importance for the cooperation between users and manufacturers. Terms such as contact overlap, relaxation, gas-tight connections or contact corrosion are frequently used, but not everyone is always familiar with their exact meaning. It is particularly important for the discussion partners to know which aspects are being discussed, especially when analyzing and correcting errors. The workshop explains the most important technical terms of electrical connectors. All relevant areas from mechanics, electrical engineering, materials science and qualification are covered. For each technical term there is a precise definition, a basic technical explanation and an explanation of the meaning of the term in case of a fault. The aim of the workshop is to provide the participants with a glossary at the end of the workshop, which will help them to look up the various terms in the field of electrical connectors quickly and in a well-founded manner.

The participants learn in the lecture:
  • Important characteristic values for connectors
  • Technical explanation of the characteristic values
  • relevance of the characteristic values in various applications
Speaker: Dr. Helmut Katzier | Ingenieurbüro Katzier

Dr. Helmut Katzier studied communications engineering at the University of Applied Sciences Darmstadt and theoretical electrical engineering at the Technical University Darmstadt. Afterwards he was a research assistant at the Institute of Theoretical Electrical Engineering there for five years. After his doctorate, Dr. Katzier worked for Siemens AG in the Public Networks division. From 1 July 2006 to 29 February 2012, he worked for TietoEnator Deutschland GmbH and Tieto Embedded Systems GmbH. Since 1 March 2012 he has been working independently in the area of development, consulting and training. His diverse fields of activity include, among others, packaging and interconnection technology, especially in the areas of printed circuit boards, connectors and high-speed transmission technology. At the Technical Academy Esslingen, he leads the seminars connector technology, PCB technology, cables and wires, high-speed design of electronic assemblies and systems as well as the seminar EMC-compatible board and system design. He is also a speaker in the seminar Design of High-Frequency Circuits.

5.00 - 6.30 pm
The Steckverbindarium (Connector Basics)
Speaker: Herbert Endres | Endres Consult

Herbert Endres is a qualified engineer and studied telecommunication engineering at Nuremberg's Ohm Polytechnic (now TH Nuremberg). From 1971, he worked in project planning and service for electronic industrial controls, then product manager for passive components. Since 1978, he has led sales, marketing, and product management activities for connectors and interconnect systems at TRW Cinch, Labinal, and Molex. In 2006 he was appointed technology marketing director at Molex LLC being responsible for technology and new projects. Since 2017 he works as a freelancer with regard to questions about connectors and connector applications.

Basic Seminar B

3:10 PM

3.10 - 4.40 pm
Basics of Contact Physics
Speaker: Dr. Helge Schmidt | TE Connectivity
5.00 - 6.30 pm
Plating of Contact Materials
Speaker: Markus Klingenberg | IMO Oberflächentechnik GmbH

Dipl.-Ing. Markus Klingenberg has been working for IMO Oberflächentechnik GmbH as head of research and development since 2017. After his training as an electroplater he studied surface technology and materials science at the University of Applied Sciences in Aalen. From 1997 until today he held various positions in the strip electroplating sector as head of quality assurance and production manager and has more than 20 years of expert knowledge in the field of research & development.

Basic Seminar C

3:10 PM

3.10 - 4.40 pm
Rolled Copper & Copper Alloys for Connector Applications more
The selection of the right copper and copper alloys is a challenging topic. For many connector developers/designers it is not always easy to choose the technically and commercially correct material. The seminar covers all relevant basics and information on these semi-finished products for connectors, including excursions on mechanical properties, physical properties and a brief overview of the technically relevant surface for these connectors; Focus: Tin. Furthermore, the speaker will provide insights into the selection of critical parameters as well as the pitfalls that may lurk here.

The participants learn in the lecture:
  • Standard copper & copper materials
  • High performance copper materials
  • technical properties & surfaces.
Speaker: Stephan Groß | Boway

Dipl. Ing. Stephan Groß has been working in the copper alloy industry for rolled products for more than 30 years. After 29 years with Wieland-Werke AG, he joined Boway Alloy in 2020 as Global Director Technical Marketing, Rolled Products. Since 2021, he is CEO of the newly founded Boway Deutschland GmbH, based in Herborn, north of Frankfurt. In his working life he has been strongly involved in overseas markets (Europe, Asia and North America) and has worked for many years in Singapore.

5.00 - 6.30 pm
Engineering Polymers for connectors - criteria for material selection more
Engineering plastics for connectors - selection criteria A short introduction (chemical structure) about the plastics which are suitable for connectors . Based on typical connector requirements, the material properties and thus the selection criteria are explained. Due to new market requirements (high voltage, high-speed , ADAS,...) properties like flame retardancy , mechanics, electrics and dielectrics and construction (precision) are considered in more detail with test methods and application examples.

The participants learn in the lecture:
  • which engineering plastics are suitable for connectors
  • when which material is the right decision
  • raw material prices are not component prices
Speaker: Monika Taut | Celanese

Monika Taut graduated from Technical University from Chemnitz with a Master Plastic-Mechanical Engineering. She worked as a designer for plastic components for cassette recorders. For almost 30 years she has worked in various positions in this company (Hoechst/Ticona/Celanese). She has been working in the automotive industry for 12 years. As a Field Development Engineer at Celanese in Sulzbach, Hessen she is the lead engineer for Europe in the areas of Electrical/Electronic and e-Mobility applications.

Wednesday, September 8, 2021

8:00 AM
Registration
9:00 AM
Welcome Address
Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS
9:10 AM
Keynote: Trends in Electronic Components and Systems (ZVEI Roadmap "Next Generation") more
The ZVEI Technology Roadmap supports companies in dealing with topics such as artificial intelligence, industry 4.0 or cyber security. The compendium, now in its fourth edition, offers a structured overview of many topics relating to digitization in the electrical and electronics industry. In addition to progress in the development of electronic components, it also looks at software, material trends and aspects of production, as well as guidelines and laws and the corresponding fields of application. The special feature of the ZVEI Technology Roadmap is its holistic approach and outlook up to the year 2025, highlighting the process of product development as well as political developments and trends in research and education.

The participants learn in the lecture:
  • The compendium offers a structured overview of many topics of digitization in the electrical industry
  • This roadmap supports companies in dealing with topics such as artificial intelligence, Industry 4.0 or cyber security
  • In addition to progress in the development of electronic components, it also takes into account software, material trends and aspects of manufacturing, as well as guidelines and laws and the corresponding fields of application.
Speaker: Dr. Andreas Lock | Bosch

After PhD in Solid State Physics (MPI für Strömungsforschung, Göttingen, Germany) Mr. Lock joined the sensor development center of Robert Bosch GmbH in Reutlingen. Mr. Lock held several positions in sensor development, electronics manufacturing, and ECU development and joined a JV with Hyundai Motors in Korea as head of the KEFICO Engineering & Technology Institute (KETI) for engine management ECUs. From 2011 till 2015 he was responsible for the innovation and technology management at Automotive Electronics division where he built up an innovation lab and introduced a technology management framework. Since 2016 he joined a corporate technology department as head for the Systems Engineering for E/E architectures and change end of 2018 to powertrains solutions for his current position as head of development for E7E architecture and Software Excellence.

9:40 AM
The Intelligent Connector as "Enabler" of Vision Production Level 4 of Smart Factory more
To support the "Production Level 4" vision of the SmartFactoryKL, several connector manufacturers are jointly developing use cases for a smart connector with the objective to describe a universal interface for production modules to the supply and communication infrastructure, which can also be safely operated by unskilled users. These use cases are based on additional functions of the connector which may implement relevant elements of the safety concept of a production module, such as locking the connector under voltage. The consideration of different use cases leads to the description and detailing of a data model including service interfaces and state transitions and thus, in terms of Industry 4.0, to sub-models of the Asset Administration Shell with product-specific semantics.

The participants learn in the lecture:
  • Use cases for smart connectors with additional functions
  • Development of a data model, service interfaces and state diagrams for the implementation of the additional functions
Speaker: Dr. Michael Hilgner | TE Connectivity

After his diploma in electrical engineering with a focus on communications in 1997 and his Ph.D. in the field of numerical calculation of electromagnetic fields at the Technical University of Darmstadt in 2000, Dr. Michael Hilgner headed the development of a signal integrity and circuit simulation software at the company CST in Darmstadt. In 2008 he joined NOKIA, where he worked as a specialist for Electromagnetic Compatibility in the development of mobile devices at the location in Ulm. From 2010 to 2015, at the VDE in Frankfurt, Germany, he was responsible for the technical management of standards in various areas and also represented the German National Committee in steering groups and strategy committees of the IEC and CENELEC. Since 2015 he has been coordinating the engagements in consortia and standardization of TE Connectivity’s business unit “Industrial”.

10:10 AM
Digitization of Electrical Interfaces with AutomationML as a Basis for new Business Models
Speaker: Markus Rentschler | Balluff

Markus Rentschler is with his team responsible for the standardization and development of OT/IT system interfaces for the Balluff product families and also an active member or lead in several external standardization activities.

10:40 AM
Coffee Break and Exhibition
11:10 AM
PCB Terminals as Ethernet Interface: Alternative Connection Options for IoT and IIoT Devices more
RJ45, M12, and M8 connectors are common connectivity options in a network cabling infrastructure and as interfaces for Ethernet/IP-enabled devices. The entire Ethernet ecosystem is complemented by Single Pair Ethernet. What if you wouldn‘t need a such a connector for Etherent/IP-enabled devices, and what impact does that have on the IoT world today and tomorrow? We have investigated this question in relation to alternative connection options for Ethernet interfaces of devices. The answer is PCB terminals. Compared to RJ45 or M12 connectors, they offer a variety of advantages such as component reduction, ease of assembly, size and color coding.

The participants learn in the lecture:
  • Data transmission rates and the impact on PCB design/layout

  • Handling of cable entry, strain relief, cable shield and advantages of terminal block types
  • Applications and limitations of PCB terminal blocks.
Speaker: Patrick Hirt | Metz Connect

During his B. Eng. and M. Sc. studies in Industrial engineering at the Baden-Württemberg Cooperative State University, Patrick Hirt was already active in the product management at METZ CONNECT GmbH. Until the beginning of 2021, he was product manager for cabling solutions for networks, especially Distributed Building Services, Industrial Ethernet, Automated Infrastructure Management Systems and Single Pair Ethernet. As Sales Director International, he is now responsible for the sales of cabling solutions for networks and electromechanical components. Furthermore, as a member of the SPE Industrial Partner Network and PNO working group, he is actively involved in the development, expansion and knowledge transfer of new technologies, applications and solutions.

11:40 AM
Standard in Sight – Finally Consensus on M12 Push Pull
Speaker: Dirk Peter Post | Harting

1998 HARTING hired me as a product manager for Circular Connectors. Since 2014 I am Head of Product Management Circular Connectors.

Speaker: Jürgen Sahm | Phoenix Contact
12:10 PM
Lead-free High-current Contacts for RoHS Compliance without Exemption 6c
Speaker: Achim Engel | Würth Elektronik ICS

After training as a radio and television technician, Achim Engel studied industrial engineering and joined the Würth Electronics Group in 2002. His focus are contact solutions for printed circuit boards. As division manager, he is responsible for the market launch of high-current contacts (Powerelements) and the SKEDD direct plug-in technology.

12:40 PM
Lunch Break and Exhibition
2:00 PM
Experience Feedback: Modular Jack Cat6 Qualification per TIA-568 (engl.) more
Modujar Jacks were a group of standardized connectors intended for phone communication. As the Ethernet adopted these connectors for its physical layer, new standards arose for high-speed data transmission and power transmission, beyond the needs for simple voice-level frequencies. Here is a field report of the testing and qualification of our unfiltered Cat6. connectors.

The participants learn in the lecture:
  • Short introduction to high-frequency signal phenomena in connectors
  • Details on PCB design and device calibration for high-frequency testing
  • Power-over-Ethernet testing (hot-plugging, durability)
Speaker: Baptiste Bouix | Würth Elektronik
2:30 PM
Floating elements - movement instead of standstill more
The technology of through-hole technology has been used in the electronics industry for decades, which means that components with solder tabs are inserted through a hole in the board and soldered on the back. However, this does not make sensible use of valuable space on the back of the board and the idea of surface mounted solutions, i.e. products placed and soldered on one side only, was developing. Combined with the risk that the connection is only electrically and mechanically connected via the soldering point and therfore any error, especially if the board is only slightly contaminated, could lead to poor connection and thus also to unstable mechanical adhesion of the component. From this WECO developed the Floating Elements Technology, in which components have the property to adapt to the surface, its mechanical deformation with temperature differences and with different melting points of the soldering paste, to a certain extent, and to compensate for these types of defects by the individual mobility of the inner metallic components. This is, in a sense, starfish technology. In the presentation, the pioneering ideas, solutions, advantages and technical properties are presented with examples, investigations and results, and the groundbreaking solution is explained by means of customer solutions.
Speaker: Detlef Fritsch | Weco

Detlef Fritsch, born 1960, started his career as an officer in the German Bundeswehr and completed his university studies in electrical engineering. 1991 he started in the sales department of data communication technology. He grew up as sales manager at AEG Lichttechnik GmbH/ Philips and then assumed global responsibility for lighting solutions in the automotive industry as head of key account. Since 2016 he is responsible for the EMEIA division as Managing Director at WECO Contact GmbH.

3:00 PM
Coffee Break and Exhibition
3:30 PM
Application-specific Analysis of the Heating of Power Connectors at High Transient Currents Using Equivalent Thermal Circuit Diagrams more
Connectors as used in high-power architectures of electric vehicles are experiencing high thermal stresses. On the other hand, the high loads in the automotive industry are present for short times only in most cases. Therefore, it is necessary to pay special attention to thermal aspects during design of high-power connectors. Thermal networks provide the opportunity to simulate complex and long current profiles, as occurring in real driving cycles, in an easy manner. Additionally, it is possible to consider specific cooling conditions in the harness/surrounding and convection conditions like ducts or radiators. To harmonize this simulation approach a technical guideline has been generated under leadership of ZVEI (Zentralverband Elektrotechnik- und Elektronikindustrie e.V.).
Speaker: Dr. Michael Ludwig | TE Connectivity Germany

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4:00 PM
Coupling Inductance as Parameter for the EMC Behaviour of Board-to-board Connectors more
Digitalization in all aspects of industry, such as the Internet of Things (IOT), Industry 4.0, Smart Grid as well as Smart Home, is constantly progressing and requires secure HighSpeed data transfers, from sensor to cloud and everything in between. Electronic devices continue to get smaller and more powerful with layouts that are increasingly based on modular design. To save time and expensive design changes, individual components and modules should undergo EMC testing to verify their functionality in target application environments, prior to final assembly. The module’s requirements can be applied to its connecting elements accordingly. A possible description of EMC properties in a connector can be provided by the coupling inductivity, which this lecture will examine in detail.

The participants leanr in the lecture:
  • What is coupling inductivity and how to measure it?
  • Which constructive challenges have to be faced when developing a shielded connector?
  • How do shielded and unshielded connectors compare in practice?
Speaker: Carsten Stange | Langer EMV-Technik

Graduate engineer Carsten Stange successfully completed his electrical engineering degree at the technical university in Dresden. Since 2008, he’s been a design engineer at Langer EMV-Technik GmbH as part of research and development in the field of electro magnetic tolerance. He focuses on near field scanning of assemblies and switching circuits, the implementation of susceptibility tests as well as device development and the qualification of connectors.

Speaker: Stefan Frömmrich | ept

Graduate engineer Stefan Frömmrich studied mechanical engineering at the Kempten University of Applied Sciences. He wrote his graduate thesis in cooperation with ept GmbH covering the mechanical properties of printed circuit boards for press-fit technology. Stefan Frömmrich has been working as a design engineer in pre-development of PCB connectors at ept GmbH since April 2014. As a project manager he’s responsible for development and qualification of new connectors and processes and represents ept in several international committees.

4:30 PM
Coffee Break and Exhibition
4:50 PM
Quality, Shelf Life and Failure Analysis of Connectors more
Due to the immense significance of connectors for the proper functionality of an assembly, it is essential to check the quality and reliability of these components. Various methods are available for quality control or failure analysis. In addition to non-destructive testing, such as layer thickness measurements, analyses of the quantitative material composition via XRF or contact resistance measurements, destructive analyses, e.g. microsectioning for a SEM-EDX analysis or spatially-resolved hardness measurements, can also be peformed. A further aspect is the performance of life- and environmental tests. Some of these methods are explained and illustrated by practical examples. Furthermore, it will be shown how long-term storage of critical components can be used to solve the problem of insufficient availability of spare parts.

The participants learn in the lecture:
  • Various methods for quality control or failure analysis of connectors
  • Solution to the problem of insufficient availability of spare parts due to the constantly
Speaker: Holger Krumme | HTV

Studies in Electrical Engineering (communications engineering) at TU Dortmund University,

1994 to 2001: Co. for hardware and software development of microcontroller circuits and quality management,

since 2001: Technical Director of the test house HTV-GmbH in Bensheim as Managing Director –Technical Operations

5:20 PM
Optical Inspection of the Connector Geometry more
Deficient geometry of connector pins causes serious errors, such as system shortage. imess presents a concept for measurement capable, operator independent control of the Mate and PCB side. Therefore, the connector geometry is recorded with laser scanners which create a three-dimensional image. Even high wall housing can be scanned entirely. While the connectors built on the workpiece carrier run below the sensors, the 3D scan is transferred to the image processing software. The pin planes are determined by using the raw data as well as the pin location and height relatively to the nominal values. The software presents the results of various characteristics such as reeling circle (top of the pin), co-planarity and length of contacts.

The participants leanr in the lecture:
  • How is it possible to design the inspection system measurement capable?
  • What advantages does the optical inspection of the pins have?
  • How are position and geometry of the connector calculated from raw data?
Speaker: Patrick Telders | imess

Patrick Telders, born 1987, is part of imess since 2012. During his studies in electrical engineering, he gained insight into the field of image processing. Finishing his degree, he continued as project engineer at imess. Since 2019 he is general manager and responsible for selling the tailor-made inspection systems.

5:50 PM
Optical Dimensional Measurement of Press-fit Zones with Focus Variation more
The rapidly growing electromobility market is just one example of the application of special press-fit technologies for the production of solderless electrical connections. Different types of these press-fit zones have one thing in common: the geometry is one of the crucial factors for a high-quality connection. This fact and additionally the growing demand for this technology lead to more and more complex requirements for the measurement technology. Important parameters, such as the thickness, the diagonal, the radii at the press-fit zone, as well as the geometry at the transitions from the press-fit zone to the press-fit tip must be measured traceably with high accuracy, but also with high measuring speed. The presentation will show how the two technologies Focus Variation and Real3D make it possible to measure high-resolution 360° 3D datasets, which in a further step serve as the basis for evaluating the required parameters. The main focus is on meeting the high accuracy and traceability requirements of the measurement tasks of these components according to the new "IPS 9797-Press fit Standard for Automotive Requirements and other High-Reliability Applications", in which the optical dimensional measurement of the press-fit zone has also been included.

The participants learn in the lecture:
  • Traceable optical measurement technology
  • Focus Variation
  • Optical measurement of press-fit zones
Speaker: Thomas Lankmair | Bruker alicona

Thomas Lankmair is Director of the Application Competence Center at Bruker Alicona. He graduated from the higher technical school for machine construction/manufacturing technology in Austria. He successfully completed his subsequent studies in Innovation Management at the FH Campus 02. The Application Competence Center comprises both the application department and special solution development.

6:20 PM
Final Discussion
Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS

Thursday, September 9, 2021

8:00 AM
Registration
9:00 AM
Welcome Address
Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS
9:10 AM
New Approaches for Agricultural Electrification more
The interface between tractor and attachment plays a decisive role in electrification in the agricultural sector. Different tractor manufacturers must be compatible with different attachment manufacturers in order to achieve the greatest possible acceptance in the market. To this end, it is necessary to provide a standardised interface for the transmission of electrical energy. This interface must be usable in the harsh environment of agriculture and transmit high electrical energy under adverse conditions. The interface developed by the members of the AEF (Agricultural Industry Electronic Foundation) is the standardized interface between tractor and attachment with the AEF High Voltage Connector.

The participants learn in the lecture:
  • Electrification in the agricultural sector
  • Environmental requirements for solutions in the agricultural sector
  • Advantages of Standardisation
    Speaker: Jürgen Bösch | Harting Electric

    For more than 20 years engaged in product marketing for heavy industrial connectors

    9:40 AM
    Series-capable high-current contacts as the key to efficient production of integrated e-vehicle drives. more
    KontACt-E - Series-capable high-current contacts as the key to efficient production of integrated e-vehicle drives. The public funded project aimed to investigate high-current contact technologies up to 600 A that can be used in mass production and replace screw connections in power electronics. The consortium has succeeded in developing and testing (vibration, derating, etc.) high-current connectors for various copper rail / busbar applications as well as PCB contacting. These new contacts are to be used in the future as a "plug&play" solution in e-vehicle drives.
    Speaker: Thomas Schriefer | Fraunhofer IISB

    Study of mechanical and industrial engineeering at the University of Erlangen-Nuremberg. Since 2014 PhD candidate at the Fraunhofer Institute of Intergrated Systems and Device Technology, supervised by the chair of Electron Devices in Erlangen. The focus of research is on the vibration resistance of electrical components at spectral input load.

    10:10 AM
    New Generation of High-current Connectors for Railway Technology
    Speaker: Denny Heilige | Harting Electric
    10:40 AM
    Coffee Break and Exhibition
    11:10 AM
    Survey of Silver Passivations and its Testing Methods more
    The aim of the project is to provide a practical guide to the selection of the right passivation. Which type is suitable? What are the properties? What do users and coaters have to consider? The market is very confusing due to the large number of variants and the large number of private labels. This not only makes the selection of passivation very difficult, but often also prevents several suppliers from being qualified. The creation of transparency is an objective of the project. The precise definition of the testing is also important. There are differences in the test regulations of the manufacturers, but also of the users. Therefore, another goal of the project is to compare the different test methods.

    The participants learn in the lecture:
    • What types of passivation for silver are there?
    • What are the differences?
    • How to test passivation?
    Speaker: Oliver Brenscheidt | ON Metall

    For more than 20 years Oliver Brenscheidt has been engaged in the electrochemical plating of technical layers such as tin, silver and gold. After studying chemistry and an apprenticeship as an electroplater, he worked for 15 years in his family-founded electroplating shop before becoming self-employed in 2016. Brenscheidt Galvanik Service offers analytical services, especially in failure analysis, develops new systems on behalf of the customer and conducts training courses. It has its own laboratory in which both testing and coating can be carried out. With the Internet project silberbird.de, Oliver Brenscheidt makes information available to coaters and their customers on the Internet. In addition to specialist essays, visitors can also profit from a podcast series in which the daily life of a coater is reported.

    11:40 AM
    Precious and non Precious Marriages. Is it Possible to Marry Different Contact Surfaces? more
    Noble and non-noble contact surfaces are often offered in identical designs. Manufacturers and industry recommend to match only identical surfaces. The purpose of the contact surfaces is known, the Brownian molecular movement explains the background for the nickel barrier layer. The electrochemical voltage series is the real reason why different contact surfaces should not be plugged together. In connection with the decomposition voltage of water, it explains why contact corrosion can occur. This thesis is supported by practical experience. However, one has to be aware of the effects of pairing uneven contact surfaces, because not only the voltage levels may change, but also the other properties of the connector pair become limited.

    The participant learn in the lecture:
    • What is AutomationML?
    • How are industrial connectors modelled?
    •  How are cables modelled?
    Speaker: Herbert Endres | Endres Consult

    Herbert Endres is a qualified engineer and studied telecommunication engineering at Nuremberg's Ohm Polytechnic (now TH Nuremberg). From 1971, he worked in project planning and service for electronic industrial controls, then product manager for passive components. Since 1978, he has led sales, marketing, and product management activities for connectors and interconnect systems at TRW Cinch, Labinal, and Molex. In 2006 he was appointed technology marketing director at Molex LLC being responsible for technology and new projects. Since 2017 he works as a freelancer with regard to questions about connectors and connector applications.

    12:10 PM
    Lunch Break and Exhibition
    1:50 PM
    Under power - Conductive plastics cleverly used! more
    Under power - Conductive plastics cleverly used! Across all industries, the requirements for materials with regard to the functional integration of electronic components are growing due to more compact construction methods and new design concepts. The topics of thermal management and EMC shielding play a major role in this context. Their necessary properties can be achieved by the use of plastics. A fundamental understanding of the interrelationships between materials and their effects is the basis for using this group of materials to effectively dissipate heat from components or to achieve the required shielding effectiveness. Within joint projects, investigations have been carried out in this context. In order to derive options for action for one’s own product development, the results are reflected in this presentation. The results of which will be reflected in this presentation with the aim of deriving options for action for one's own product development.

    The participants learn in the lecture:
    • Possibilities and limits of the use of plastics
    • Parameters and influential factors
    • Options for action
    Speaker: Michael Tesch | Kunststoff Institut Lüdenscheid

    Dipl.-Ing. Mechanical Engineer, specializing in plastics technology since 1994 employee at the Kunststoff-Institut Luedenscheid, laboratory department 1999 Head of the Materials Testing and Failure Analysis Department 2007 Establishment of the materials technology/ new materials department since 2007 Head of the Materials Technology/New Materials Department

    2:20 PM
    Novel High-speed Laser Structuring of Connectors to Reduce Insertion Forces
    Speaker: Univ.-Prof. Dr.-Ing. Frank Mücklich | SurFunction

    Univ.-Prof. Dr.-Ing. Frank Mücklich:
    - Inhaber des Lehrstuhles für Funktionswerkstoffe @ Universität des Saarlandes (www.fuwe.uni-saarland.de)
    - Gründungsdirektor Material Engineering Center Saarland (www.mec-s.de)
    - Mitgründer der Surfunction GmbH (www.surfunction.com)
    Forschungsschwerpunkte und Publikationstätigkeit: (13 Patente, >520 Publikationen, h-Index: 48)
    - 3D-Gefügeforschung auf der Mikro-, Nano- und atomaren Skala, - Oberflächenfunktionalisierung durch interferierende Laserstrahlen, - Gefügeentwicklung maßgeschneiderter metallischer Struktur- und Funktionswerkstoffe.
    Ausgewählte Leitungsfunktionen:
    - Deutsche Akademie der Technikwissenschaften acatech – stv. Sprecher Materialwissenschaft und Werkstofftechnik
    - 2019/2020: Präsident der Deutschen Gesellschaft für Materialkunde (DGM)
    - Fellow der American Society for Materials (FASM)
    - Leiter der Europäischen Schule für Materialforschung (www.eusmat.eu)
    - Herausgeber der „Practical Metallography - Preparation, Imaging and Analysis of Microstructures“ (De Gruyter Publisher).

    2:50 PM
    Coffee Break and Exhibition
    3:20 PM
    PVD technology - from corrosion protection to surface conductors more
    A new form of surface modification is presented. A combined process technology is de¬scribed to apply precious metals, e.g. gold environmentally friendly, resource-saving and cost-effective to a large extent geometry-independent (3D) on small parts, e.g. connectors on an industrial scale. PVD technology has been state of the art for many years and is often used to improve tool life. However, the donor material used achieves only about 20 % of its target while the re-maining 80 % land on the walls of the reactor. The coating material is very inexpensive and environmentally neutral, which is why these losses are irrelevant. In the case of precious metals, however, this is the core problem. WBT has developed a method that reverses the benefit/loss ratio. And the remaining 20 % pure gold is almost completely recycled., ecologi-cally problem-free. This process technology consists essentially of the direct connection between high-current plasma polishing and special 3D-PVD technology, which makes working with precious met¬als useful. There are hardly any application restrictions compared to electroplating. The (gold) layers are thinner, but error-free (high vacuum), densely structured and equipped with higher bind¬ing energy. The process energy requirement is about 26 % and the resource consumption is about 35 % lower. It is the qualitative and ecological alternative to electroplating. The disadvantages lie in the high investment in equipment and the demanding handling. On the other hand, the unit costs are even lower in industrial use! Finally, this technology opens up future development possibilities, e.g. to the surface con-ductor, using new, also non-metallic conductive materials, e.g. doped carbon or possibly graphene. Interesting is not only the scalable conductor function of such perspectives, but also the permanent corrosion resistance without additional corrosion protection. In our PP presentation, we would like to present the research results of external institutes on the topics of abrasion resistance, corrosion behaviour and contact quality.
    Speaker: Wolfgang B. Thörner | WBT-Industrie

    The business economist (FH) gained technical experience in the automotive industry before founding the WBT industry in Essen in 1985. The purpose of the company was the development and production of high-quality electromechanical connectors. In the course of time, what began as a purely mechanical engineering company has become more and more a company with nanotechnical know-how within the framework of precision engineering. Today, in addition to plastic manufacturing, WBT also runs complex surface (3D) PVD-Plasma modification, which can process metals incl. precious metal, and potentially also semiconductors, on a serial scale. The performance range spans from corrosion protection to surface function conductors. ...and the WBT high-performance connectors are available after-again.

    3:50 PM
    Latest Developments in Multi-slide Die Casting more
    The trend in connector industry targets for years in reducing space, reducing weight, performance compression, shielding and developing modular systems. In this respect, "miniaturization" is no longer limited to designing devices and components ever smaller, but increasingly requires more precise and complex components and surfaces. This leads to new challenges for die-cast parts: - increasingly thin walls - tighter tolerances - surfaces with technically, visually and haptically higher quality While the optimization potential of conventional tool and casting machine technologies has been largely exhausted, interesting further developments in multi-slide die casting have been advanced and brought into mass production readiness. In the presentation, the multi-slide die casting technology will be presented as well as its possible application areas (including advantages and disadvantages) compared to conventional die casting technology. The main part of the presentation shows the latest developments in multi-slide technology: - Shortening the casting runners (distance of the melting pot to the die cavities) - Servo drives for better process control (parameterization of the complete injection process) - Development of the hot chamber multi-slide technology for aluminum The consequential new design options for components made of zinc, aluminum and magnesium are then presented by using examples. The presentation targets at die casting experts as well as expressly at non-experts. The non-expert (e.g. project manager, strategic buyer) will be introduced to the function of multi-slide die casting technology and its typical areas of application, and will learn which components and geometries can be advantageously manufactured with this technology. The experts (e.g. device developer and component designers) will be introduced to the latest developments in multi-slide die casting technology and the resulting expanded design options with regard to geometries and tolerances.
    Speaker: Armin Beck | Dynacast

    1990-1995 Studied mechanical engineering / University of Stuttgart

    1995-2000 Designer / machines and plants

    2000-2006 Head of Engineering / Automotive Supplier / forming technology

    2007-2010 BU-Manager / Special Machine Construction / plastic welding machines

    2010-2015 Director Business Development / electromagnetic devices

    since 2016 General Manager / Dynacast Germany / precision die casting

    4:20 PM
    State of the Art and Trends in the Additive Manufacturing of Connectors more
    Additive manufacturing offers enormous potential based on a significant increase in design freedom. In order to be able to fully address these big advantages, it is necessary to qualify new materials for additive manufacturing.  PROTIQ has succeeded in developing a process with which copper can be processed using additive manufacturing. With an innovative copper alloy, PROTIQ was the first service provider, which was able to produce inductors of the highest quality. Today PROTIQ can also process 100% pure copper in 3D printing.  The material zinc opens another interesting field of application. Components made of the zinc alloy Zamak 5 for zinc die casting are widely used. PROTIQ has succeeded in developing a process for additive processing of the series material Zamak 5. Based on that, prototypes as well as small series are now able to be produced at a low component price.

    The participants learn in the lecture:
    • Advantages of Additive Manufacturing
    • Innovative Materials for Additive Manufacturing
    • Economic 3D-Printing of Connectors
    Speaker: Stefan de Groot | Protiq

    Stefan de Groot started studying industrial engineering at the University of Paderborn in October 2010. After five years, he finished his studies as Master of Science. Since August 2016, he is working at the Phoenix Contact GmbH & Co. KG, including the transition to the PROTIQ GmbH in December 2016, and acts there as project and technology manager for additive manufacturing.

    5:00 PM
    Final Discussion
    Speaker: Kristin Rinortner (Moderation) | ELEKTRONIKPRAXIS

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