Program 2026 *

In the field of electrical connectors, numerous terms from various disciplines are used, and a precise understanding of these terms is crucial for successful collaboration between users and manufacturers. Terms such as contact overlap, relaxation, gas-tight connections, and contact corrosion are frequently employed, but their precise meanings are not always readily apparent. Particularly during fault analysis and troubleshooting, it is essential that all parties involved understand the specific aspects being discussed. This seminar explains the most important technical terms related to electrical connectors, covering all relevant areas from mechanics, electrical engineering, materials science, and qualification. Each term is presented with a precise definition, a fundamental technical explanation, and an clarification of its significance in the context of a fault. The goal of this introductory seminar is to provide participants with a glossary upon completion, enabling them to quickly and reliably look up the diverse terms used in the field of electrical connectors.

This introductory seminar provides an overview of the fundamentals of contact physics, explaining key concepts and the origins of physical quantities such as contact resistance, contact heating, and derating. These phenomena are discussed in relation to contact surfaces and contact coatings. The 'contact behavior' of a connector must be considered a system property resulting from the interaction of the contact coating, connector design, electrical load, application requirements, and environmental conditions. The seminar is divided into the following sections: Contact physics fundamentals of static contacts; Measurement and simulation of contact surfaces and materials; Contact physics comparison of standard surfaces for connectors; Contact heating and derating; Fretting corrosion; Contact behavior in relation to intermediate layers; Degradation mechanisms of connector contacts

Selecting the right copper and copper alloys is a complex topic. For many connector developers and designers, choosing the technically and commercially appropriate material is not always easy. This seminar covers all the fundamentals relevant to connectors and provides information on these semi-finished products, including insights into mechanical and physical properties, as well as a brief overview of technically relevant surface finishes, with a focus on tin. Furthermore, the presenter will offer insights into selecting critical parameters and highlighting the potential pitfalls.

Cables and wires are essential for the transmission of electrical energy, data, and signals, enabling the operation of machines, devices, and communication systems. This presentation explains key terms and the construction of a cable, including conductors, insulation, shielding, and outer sheath, and clarifies technical terms such as "core," "strand," and "sheathed cable." The difference between data and power cables is also discussed, along with their respective technical requirements. The selection of the right cable for various applications, based on temperature resistance, mechanical strength, and electromagnetic compatibility, is also addressed. Finally, current developments and future trends, such as highly flexible cables, environmentally friendly materials, and smart sensors, as well as the impact of digitalization and automation on cables and wires, are presented. This seminar provides a comprehensive overview of the importance, construction, and selection of cables and wires, as well as future developments.

This connector guide illustrates the relationships and trade-offs involved in selecting and using connectors, providing the fundamental knowledge for understanding their properties and electrical specifications. It explains basic principles, material selection during manufacturing, physical characteristics, processing techniques, and the resulting implications for function and application. The fourteen chapters cover:

• What is a connector?
• Connector components
• Connection techniques
• Insulator materials
• Contact materials
• Contact surfaces
• Contact resistance
• Shielding measures
• Connector locking mechanisms
• Housings and mechanics
• Power electronics
• High data rates
• Further processing in the manufacturing process
• Connector selection.

The chapters detail the differences and present the advantages and disadvantages of individual materials, manufacturing processes, and application methods, weighing them against each other and evaluating them. Both operating limits (current load at higher ambient temperatures) and behavior at the highest data rates are addressed. This connector guide is not intended as a purchasing aid, but rather as a compendium of the diverse properties, designs, and processing options. It shows, independently of manufacturers, which alternatives are available and what the consequences of choosing certain features are, for better or for worse.

This seminar covers the theoretical foundations and principles of electroplating. Influences on deposition and a general process sequence for coating parts complement the theoretical framework. Many prerequisites regarding the base material, product design, and material selection must be met to achieve coating quality. These are discussed in detail, and in addition to the surface finish and geometric requirements of the base material, the interaction between the base and coating materials is also explained. The functional significance, advantages, and disadvantages of coating metals used in connector and electrical engineering, as well as current trends, are explored. Techniques for single-part electroplating, such as barrel, vibrobot, and rack plating, are presented using videos, and the possibilities of coating are illustrated with product examples. Selective plating of individual parts completes the portfolio of bulk material coating. The differences and advantages of strip plating compared to single-part plating then form the transition to strip plating. This section delves further into the specific process flow of coil plating and explains the various methods, such as immersion, brush, strip, and spot plating, using films and different selective tools. Additionally, the process-related tolerances and specifications of the various techniques are discussed, as well as the dimensional limitations of coil plating technology. Practical experience and product examples support the presentation.

In particular, the fire properties, thermal, mechanical, and electrical properties of engineering plastics are discussed, using examples, as a guide for material selection in connectors. The very different requirements arising from various markets (automotive, electrical, electronics) are taken into account. After the presentation, attendees will be able to select the material that best meets their specific requirements from the wide range of available plastic types.

In industrial practice, the immunity of electronic systems to transient disturbances such as bursts (IEC 61000-4-4), ESD and surges is often assessed primarily using protective components. However, field observations show that this approach is systematically inadequate. The decisive factor for the robustness of a system is not the individual component, but the architectural control of current paths, references and impedances – especially in the area of interfaces and connectors. Connectors act as a central transition point where common-mode disturbances are transformed into differential disturbances. Unbalanced shield connections or inductive contacts can amplify this conversion, meaning that robustness depends not on standards or components, but on the physical design of the system.

AThe starting point is the well-known emission phenomenon, in which differential signals are converted into common-mode currents by unbalanced impedances and radiated via cables. In transient immunity, this principle works in reverse: externally coupled interference is primarily coupled as common-mode currents on cables and is coupled into the electronics by unbalanced impedances, weak ground connections and geometric asymmetries. System shield attenuation is frequency-dependent and is determined by the weakest path. Even with high-quality cable shielding and a stable housing, a connector with a medium shield connection can significantly reduce the overall shield attenuation. Resonances, frequency-dependent inductances and common-mode-to-differential-mode conversion exacerbate this effect. Practical examples show that standard connectors such as USB, RJ45 or SUB-D only provide moderate attenuation values, which means that the internal voltages in the electronics are well above the standard requirements. Highly shielded connectors, on the other hand, achieve sufficient shielding attenuation to reliably ensure immunity to interference. Typical interference in the field is often in a critical range. Only high-quality connectors and a well-designed overall system ensure that industrial immunity requirements are met. 

The workshop provides engineers with a consistent physical understanding of why robust interfaces can only be achieved through deliberately designed current paths, controlled impedances and high-quality shield connections in the connector, and introduces architectural concepts such as multistage protection with the connector as "stage 0".

Modern serial data buses such as USB or Ethernet are based on the principle of differential data transmission. This workshop provides an insight into the fundamental electromagnetic processes involved in this form of data transmission. The focus is on the greater immunity to external interference and the extensive independence from ground connections compared to signal transmission via single conductors. 

We cover and explain fundamental concepts such as common-mode and differential-mode operation, impedance, crosstalk, and mode conversion. Differential S-parameters are also discussed in this context.

Using application examples, we will highlight the requirements for connectors in differential signaling systems. We will examine propagation time differences between individual conductors and their compensation, as well as impedance characteristics to prevent reflections. This section concludes with strategies for avoiding common-mode interference in connectors through symmetrical design and shielding to mitigate unavoidable interference. 

Participants receive a clear visualization of these effects through animated 3D simulations, largely avoiding the presentation of complex mathematical relationships. Additionally, we conduct experiments with the vector network analyzer, during which participants can verify the discussed effects by measuring simple and easy-to-understand test circuit boards.

What you will learn:

• Fundamentals of differential data transmission, including S-parameters
• Application examples and visualization through animated 3D simulations
• Comparative measurements using the vector network analyzer

Current dominant market trends such as the energy transition, sustainability, e-mobility, and medical technology are associated with new requirements for the products used. This also applies to connectors. In the field of electric mobility, connectors must meet specific requirements when used in charging infrastructure, power control, and thermal management. In the renewable energy sector, they are frequently used outdoors for power distribution, signal transmission, and control of wind power and photovoltaic systems. Furthermore, there are advancements such as multifunctional connectors. Additionally, connectors are becoming increasingly “smarter” through the integration of sensors, actuators, and display elements. Reliable and trouble-free operation is essential in many applications, such as safety-critical systems or medical technology. 

To reduce risks and ensure quality, they are also tested for resistance to moisture and liquids. During IP protection class testing, type samples or prototypes are tested in the laboratory in accordance with the required IP protection class. This is a type test. If there is a requirement to deliver every product in a tested condition, a unit test becomes necessary. For this purpose, the leak test is integrated into the production process as an end-of-line test. 

Depending on the condition of the connector and whether it is installed as a standalone product, as an assembled unit, or within a system, different requirements arise for the technical design of the leak test in the production process. Some connectors do not need to be leak-tight in the area of the blade strip at all; rather, only the mated unit consisting of the connector and mating connector needs to be leak-tight. Occasionally, a through-hole is specifically provided in the connector, which allows for venting of the entire system when installed. And during the leak test, the system can be tested via this hole. The condition of the connector (leaking or not in the area of the contact strip) and whether it is to be tested as a single product, as a mated unit with a mating connector, or installed in a housing affects the design of the leak testing process and the type of adaptation required. 

Building on the fundamentals of leak testing, this workshop presents a practical guide for leak testing different types of connectors. This is supplemented by a variety of practical tips for implementing leak testing in practice. 

What you will learn: 

• IP protection classes for water testing / type testing versus unit testing
• Leak testing during production using compressed air / adaptation of connectors
• Practical examples / practical tips / FAQ

Modern serial data buses such as USB or Ethernet are based on the principle of differential data transmission. This workshop provides an insight into the fundamental electromagnetic processes involved in this form of data transmission. The focus is on the greater immunity to external interference and the extensive independence from ground connections compared to signal transmission via single conductors. 

We cover and explain fundamental concepts such as common-mode and differential-mode operation, impedance, crosstalk, and mode conversion. Differential S-parameters are also discussed in this context.

Using application examples, we will highlight the requirements for connectors in differential signaling systems. We will examine propagation time differences between individual conductors and their compensation, as well as impedance characteristics to prevent reflections. This section concludes with strategies for avoiding common-mode interference in connectors through symmetrical design and shielding to mitigate unavoidable interference. 

Participants receive a clear visualization of these effects through animated 3D simulations, largely avoiding the presentation of complex mathematical relationships. Additionally, we conduct experiments with the vector network analyzer, during which participants can verify the discussed effects by measuring simple and easy-to-understand test circuit boards.

What you will learn:

• Fundamentals of differential data transmission, including S-parameters
• Application examples and visualization through animated 3D simulations
• Comparative measurements using the vector network analyzer