PROGRAM

Agenda *

Program of the 2024 Connector User Congress

3 Days of Concentrated Connector know-how

From Single Pair Ethernet, intelligent connectors, materials and coatings to additive manufacturing of connectors: This year's program will again offer a wide range of topics.

On the first day, visitors can find out about the basics of connection technology in basic seminars ** that take place in parallel.

On the second and third days, participants will receive in-depth, first-hand know-how in numerous presentations from experts from industry, science and research.

This year, we are offering simultaneous translation of the German-language presentations into English in the plenary session. The corresponding lectures in the program are marked with flags .


Monday, June 3rd, 2024 - Basic seminars

9:00 - 10:30 am

Registration of participants at the VCC Vogel Convention Center

10:30 - 12:00 am

Parallel Basic Seminars in the morning 

(VCC Seminar Rooms)

Seminar 1: Connectors – Important Parameters and Terms

What you learn: Important characteristic values for connectors, technical explanation of the characteristics and relevance of the characteristics for various applications

  • Description

    In the area of electrical connectors, many terms from different disciplines are used, and precise knowledge of these terms is of great importance in collaboration between users and manufacturers. Terms such as contact overlap, relaxation, gas-tight connections or contact corrosion are often used, but not everyone is always familiar with their exact meaning. Particularly when analyzing and eliminating errors, it is important that the conversation partners know which aspects are being discussed. The seminar explains the most important technical terms for electrical connectors. All relevant areas from mechanics, electrical engineering, materials science and qualification are covered. For each technical term there is a precise definition, a basic technical explanation and an explanation of the meaning of the term in the event of an error. The aim of the basic seminar is to provide participants with a glossary at the end, with the help of which they can quickly and well-founded look up the various terms in the field of electrical connectors.

Dr.-Ing. Helmut Katzier | Engineering office for construction and connection technology

Seminar 2: Basics of Contact Physics

What you will learn: Basics of electrical connector contacts, influence of coating and base materials, and aging and failure mechanisms of connector contacts

  • Description

    The basic seminar introduces the fundamentals of contact physics and explains important terms and the occurrence of physical quantities such as contact resistance, contact heating and derating. These phenomena are related to the contact surfaces and the contact coating. The 'contact behavior' of a connector must be considered as a system property resulting from the interaction of contact coating, connector design, electrical load, requirement profile and the environment. The seminar is divided into the following sections:


    • Contact physics fundamentals of the dormant contact
    • Measurement and simulation of contact surfaces and contact materials
    • Contact physics comparison of standard surfaces for connectors
    • Contact heating and derating
    • Fretting corrosion
    • Contact behavior in relation to intermediate layers
    • Degradation mechanisms of connector contacts   

Dr. Frank Ostendorf | TE Connectivity Germany

Seminar 3: Copper Materials for Connectors

What you learn: Standard copper and copper materials, high-performance copper materials and technical properties & surfaces

  • Description

    Selecting the right copper and copper alloys is a challenging issue. For many developers/designers of connectors, it is not always easy to choose the technically and commercially correct material. The seminar covers all the basics relevant to connectors and provides information about these semi-finished products, including excursions to mechanical properties, physical properties and a brief overview of the technically relevant surfaces with a focus on tin. Furthermore, the speaker provides insights into the selection of critical parameters, as well as the pitfalls that lurk here.

Stephan Gross | Boway Deutschland

12:00 am - 1:00 pm

Lunch Break

1:00 - 2:30 pm

Parallel Basic Seminars in the afternoon 

(VCC Seminar Rooms)

Seminar 4: "The Steckverbinarium"

What you learn: Understanding connector components, materials and properties and weighing the trade-offs for each application

  • Description

    This seminar highlights the interrelationships and trade-offs for connector selection and application, and provides the basic knowledge to understand the characteristics and electrical data. It explains fundamentals, material selection in manufacturing, physical characteristics, processing techniques, and the resulting relationships for function and application. The fourteen chapters cover:


    • What is a connector
    • Connector components
    • Connection techniques
    • Insulator materials
    • Contact Materials
    • Contact Surfaces
    • Contact resistance
    • Shielding measures
    • Interlocking of the connectors
    • Housing and mechanics
    • Power electronics
    • High data rates
    • Further processing in the process
    • Connector selection

    In the chapters, the differences are highlighted in detail and the advantages and disadvantages of the individual materials and manufacturing and application processes are presented, weighed against each other and evaluated. The application limits (current load at higher ambient temperatures) as well as the behavior at highest data rates are discussed. The connector set is not intended to be a purchasing aid, but rather a compendium of the diversity of properties, designs and processing options. It shows, independent of manufacturers, which alternatives are available and what the selection of certain peculiarities entails, for better or for worse.

Herbert Endres | EndresConsult

Seminar 5: Surface Coating of Contact Materials

What you learn: Surface properties and geometric requirements of the base material, advantages and disadvantages of the coating metals used and the differences between strip and single electroplating

  • Description

    The seminar teaches the theoretical principles and laws of electroplating. Influences on deposition and a general process sequence for coating parts round off the theoretical basics. For the quality of the coating, many requirements of the base material, the product design and the choice of material must be fulfilled. These are covered in detail and, in addition to the surface properties and geometric requirements of the base material, the interaction between the base and coating materials is also explained. The functional significance, advantages and disadvantages of the coating metals used in connector and electrical engineering as well as current trends are discussed. The techniques of single-part electroplating, such as barrel, vibrobot and rack processes, are presented with the aid of films and the possibilities of coating are explained to the audience using product examples. The selective coating of individual parts completes the portfolio of bulk material coating. The differences and advantages of strip electroplating compared to single part electroplating then form the transition to strip coating. Here, the special process sequence for coil plating is discussed again and the various processes, such as dip, brush, strip and spot technology using films and various selective tools, are explained. In addition, the process-related tolerances and specifications of the various techniques are explained, as are the dimensional limits of strip electroplating technology. Process experience and product examples from practice support the lecture.

Markus Klingenberg | IMO Oberflächentechnik

Seminar 6: Selection of Plastics for Connectors

What you learn: Requirements for plastics for connectors, material properties of the various plastics, test methods for plastics

  • Description

    In particular, fire properties, thermal, mechanical and electrical properties of engineering plastics are discussed for the selection of materials for connectors, also using examples. The very different requirements resulting from the various markets (automotive, electrical, electronics) are taken into account.


    After the presentation, the audience will be able to select the material that best meets the respective requirements from the large number of different types of plastic.

Martin Raethlein | Rosenberger

2:30 - 3:00 pm

Coffee Break

Use Congress Kick Off "EMC Day" (Event hall "the CURVE")

3:00 - 3:10 pm

Welcome to the EMC Day

Everything about electromagnetic compatibility (EMC) in connection technology

Kristin Rinortner | ELEKTRONIKPRAXIS

3:10 - 3:40 pm

The Ten most important Basic Rules of EMC

  • Description

    Ensuring electromagnetic compatibility (EMC) in electronic devices and systems is one of the biggest challenges in the coming years. EMC is often regarded as mysterious and unfathomable. However, all the rules for EMC-compliant design can be clearly justified and simply explained. In this presentation, the ten most important basic rules of EMC are shown and explained. Their significance for the design and use of connectors will be presented in the lecture.

Dr. Helmut Katzier | Engineering office for construction and connection technology

3:40 - 4:10 pm

Advanced Shielding Technology

  • Description

    A multi-component process was developed from the combination of metal die-casting and plastic overmolding, which led to a completely new shielding and production concept:


    Once the contacts and connector head have been assembled, the actual multi-component process begins. First, a section of the cable sheath is pre-drawn so that a ring section of the cable shield is exposed. The cable assembly is then overmolded with plastic. The resulting assembly is then transferred to a second metal die-casting tool. Here, a metallic melt is cast around the previously produced body and also around the cable shield exposed on the cable. At the connector head, the molten metal encloses a short metallic sleeve, which creates the shield contact to the screw connection.


    Low-melting alloys are used as the melt, the main component being tin. This results in a very good and long-term stable contact to the mostly tin-plated braided shields or shield foils. The contact to the correspondingly coated metallic sleeve of the connector is also of very good quality. The melt temperatures are in the range of 230°C, which is comparable to the plastics that are commonly used for overmolded connectors. The resulting assembly is then transferred to a third injection molding tool in order to carry out the final overmolding with plastic.


    By cleverly designing the insulating body of the connector, a simple contact to a PE potential can be established. In addition to other requirements for pure contact resistance, the UL 2237 grounding bonding test required in the USA is a special stress test for this connection. In this test, for example, currents of 300 A are transmitted for 4 s via PE and shield. The PE connection of the interlocking system represents a parallel path that can transmit this high current without damage.

Cord Starke | Phoenix Contact GmbH & Co. KG

4:10 - 4:40 pm

Simulation and Measurement of the EMC of SPE Connectors and SPE Connection Cables

  • Description

    Introduction: A high level of electromagnetic compatibility (EMC) is generally required for SPE applications. This applies in particular to SPE connectors and SPE connection cables.


    The EMC-related behaviour of SPE cables, connectors and connection cables can be measured as coupling attenuation in accordance with IEC 62153-4-7 and, if necessary, optimized step by step. However, this requires complex sample designs.


    Instead of sample designs, suitable 3D electromagnetic simulations of the performance and EMC of SPE connectors can save time and costs during the development process.


    Simulation and analysis: The aim of the simulation is the realistic representation of quantitative results such as coupling attenuation. It must be assessed whether the design meets the requirements of the application with the existing limit values for the above parameters. It is important to visualize interference points and regions where the shielding is not sufficient. This input is particularly important for the developer so that the shielding properties can be improved in a targeted manner in order to achieve the required limit values. A typical approach is to simulate the connector and the measuring environment in an electromagnetic 3D simulation program.


    The CAD data of the design forms the basis for the simulation of the connector. These must still be modified in order to achieve realistic contacting of the individual shielding parts. As the performance of the simulation programs improves, more and more complex material properties, such as complex surface coatings, surface roughness, etc., can be realistically simulated.


    The advantage of simulation is that processes within the connector can be visualized. An analysis of the electrical and magnetic field distributions is essential for this.


    Another advantage of simulation is that reliable figures for the EMC criteria of shielding attenuation and coupling attenuation can be determined in a standardized arrangement at a very early stage of connector development, thus enabling a fast, efficient and cost-optimized design.


    Coupling attenuation: The coupling attenuation according to IEC 62153-4-7 describes the EMC-related behavior of shielded symmetrical cables and components and takes into account both the effect of the shield and the effect of the unbalanced attenuation of the pair.


    Summary: The approach presented in this article shows the ideal interlocking of simulation and EMC measurement technology at various stages of the product design process for SPE connectors and SPE connection cables.


    and SPE connection cables. The final verification of the simulation results with the triaxial method then allows important conclusions to be drawn about the quality of the simulation and enables it to be calibrated to reality, in addition to confirming that the limit values are complied with.


    Co-speakers:


    Ralf Damm | bda connectivity GmbH


    Bernhard Mund | bda connectivity GmbH


    Ralf Tillmanns | Weidmüller

4:40 - 5:00 pm

Coffee Break

5:00 - 6:30 pm

Poster Slam

The speakers present their topics on the podium in 3-minute short lectures. The best presentation will then be presented with an award by the audience.

  • Additive Manufacturing – Quality Assurance after the Printing Process

    Subject area: Current developments in additive manufacturing


    Description: The possibilities of additive manufacturing have grown more and more in recent years and now cover almost the entire material spectrum of series production. Almost all shapes can be produced that would either not be possible at all using conventional methods or only at enormous cost. With the increasing spread of 3D printing technology, it is also finding its way into electronics, making it possible, for example, to develop completely new types of connectors. Quality assurance measures are becoming increasingly important and must be taken into account accordingly. In the event of damage, a precise analysis is often the right way to improve product reliability or to gain a better understanding of the process. HTV Conservation GmbH highlights various scenarios for the quality assurance of 3D-printed components. It will be shown how the processes in 3D printing can be monitored and how product quality can be documented. Various strategies and analytical methods will be considered and their potential evaluated. 


    Dr.-Ing. Thorsten Leist | HTV Conservation GmbH

  • The Intelligent Connector of Tomorrow – an Example on the SPE3D

    Subject area: Trends in connector product and manufacturing technologies


    Description: Progressive miniaturization combined with increasing packing density is increasingly showing the limits of system integration as described by "More than Moore". For this reason, additive manufacturing processes are becoming increasingly attractive, especially for 3D electronics concepts. New generative 3D printing processes and materials are already enabling form-free and tool-free production in which electrical components can also be integrated.


    In a research project, Würth Elektronik eiSos used an SPE connector to investigate what electronics could look like in the future. This is because SPE will require completely new types of high-performance connectors. Advanced technologies such as AI-based software tools and additive technologies will be used in hybrid processes. Another increasingly important aspect is sustainability and the CO2 footprint. With additive technology, it is possible to manufacture much more economically than with subtractive technology.


    The aim of the research project is the intelligent connector, which is intended to open up new possibilities in electronics through 3D printed electronics.



    Christoph Voelcker | Würth Elektronik eiSos

  • Automation of manual coating processes with digital assistance using the example of drum and frame galvanics

    Subject area: Surface technologies


    Description: JSPS, developed by C. Jentner GmbH, is a web-based software for the automation and digitization of manual coating processes using smart coating instructions in the electroplating industry. By using UWB technology (indoor GPS), it enables precise tracking of goods carriers in the centimeter range and automates processes such as switching on rectifiers, controlling dosing pumps, ultrasound treatment, etc  adjustable zone system of the UWB software. Thus, in a building layout, zones are placed in areas of interest, for example over the electroplating baths (but dryers, storage areas, parking spaces, etc., are also possible). These can be controlled automatically with goods carriers via enter- and exit-events. Among other things, the software ensures correct compliance with specific coating sequences. The operator is optimally guided through the process by digital assistance systems, such as visual LEDs and displays on the HMI panels. All relevant process and environmental data on a product carrier basis are stored in a large datalake in Azure. By using big data analyses and AI in the field of camera-based visual control of functional galvanically coated surfaces, JSPS offers advanced analysis options, improves quality assurance and supports sustainable production.


    Marcel Scheidig | C. Jentner GmbH

  • The Smart Connector (SmEC), a Step Towards more Ecological Sustainability

    Subject area: New technologies / sustainability


    Description: By considering the digital twin, the smart electrical connector (SmEC) is embedded in a holistic approach for all connectors. The connecting element is the administration shell (AAS), which is either passive as a type or active as an instance. The new character of the SmEC, which has an active AAS, has found expression in a new VDE specification that will be published shortly. This leads to a scalable concept for connectors that provides the appropriate range of functions depending on the application. Customized connectors are possible that generate benefits throughout the entire life cycle and thus contribute to ecological sustainability.


    Andreas Huhmann | Harting Foundation    

  • Connectors in EOL testing

    Subject area: Testing and qualification of connectors and connection technologies


    Description: High currents, high voltages, leak testing, electrical contacting without contact traces: these requirements are increasingly common in the end-of-line (EOL) testing of electrical devices. As a solution, special test adapters are being developed that are connected to the test object either manually by specialist personnel or fully automatically using a robot or linear axis. While manual testing focuses on safety and ergonomic aspects, automated test plugs must compensate for positioning tolerances of the test specimen of usually up to 2.5 mm in two axes at high feed speeds. Other challenges include contact protection for HV interfaces, a lack of centering and locking options on the product and very limited installation space around the interface to be contacted. The combination of leak testing and electrical testing during the EOL test is particularly complex, as is the cooling of the adapters in continuous operation at high currents.


    Daniel De Monte | wemonte AG

  • New CuNiCoSi Material for Minaturized Connector Applications

    Subject area: Materials


    Description: to follow shortly


    Stephan Gross | Boway Deutschland

  • Enhanced Productivity with New High Speed Matte Tin for High Reliability Component Plating

    Subject area: Surface technologies


    Description: Electrolytic matte tin is the finishing layer of choice for most solderless and solderable electronic components. Matte tin, with lower whisker formation propensity and high-speed capability, is often utilized to enhance productivity while maintaining the reliability of the finished components. Although there are many commercial tin processes, most have practical limitations, such as a high sludge formation rate, use of toxic chemicals, and multiple formulation components that make the process difficult to control. These limitations restrict the process operating window. Additionally, the tin deposit crystallographic texture varies with current density, resulting in unwanted lattice orientations which are prone to whisker formation.


    Here we present SOLDERON™ST-400 High Speed Tin, a novel high speed matte tin finish with good solderability and reliability. Over the applicable current density range, the deposit exhibits stable crystallographic texture known to be less favorable for whisker formation. 


    Dr. Alphonse Foyet | DuPont

  • Sustainability in the Application meets Sustainability in the Product

    Subject area: Sustainability: PCF of plastics (DC connectors)


    Description: Plastics are versatile and high-performance materials that are used in many applications. But how can plastics become more sustainable, both in their production and in their use? This presentation will introduce two approaches that can contribute to higher resource efficiency and lower environmental impact: mass-balanced and bio-based plastics.


    Mass-balanced plastics are plastics that contain a proportion of renewable or recycled raw materials that is certified using a mass balance method. This means that the alternative raw materials used are mathematically added to the end products without having to be physically separated. This makes it possible to use the existing production infrastructure and reduce the carbon footprint of the products.


    Bio-based plastics are plastics that are made entirely or partially from renewable raw materials, such as corn or sugar cane. They can be biodegradable, but often are not. Bio-based plastics can offer advantages such as a reduction in dependence on fossil resources, an improvement in the ecological balance or an increase in functionality.


    As an example of a sustainable application, a plug connector for DC grids made of mass-balanced plastic is presented. This connector enables the efficient and safe connection of DC consumers on a factory floor, for example. By using DC grids, energy losses can be reduced, grid quality improved and renewable energies better integrated.


    The presentation shows how sustainability in the application and in the product can work together to enable climate-friendly and future-proof production. The challenges and potential of the various approaches will be discussed and recommendations for practical application will be given.


    Alexander Stammen | Phoenix Contact GmbH & Co. KG

  • Resource-saving Production of Connectors through Cold Forming

    Subject area: Trends in connector product and manufacturing technologies


    Description: Sustainable products and production processes are becoming increasingly important throughout the industry. This also includes "bans" on materials that were previously used on a large scale, such as lead (toxic). As this substance must disappear from bonded forms (alloys) in the future, new product development and manufacturing methods are extremely helpful. The production technology of cold forming is well established in the automotive sector for fastening elements, cables/pipes, springs and steering and transmission components. It is also a pioneering technology for raw material-intensive electrical connectors. Low emissions, material, resource and recycling savings in combination with efficient and energy-reduced mass production are key to the "green" products of the future. The presentation deals with the advantages and opportunities, as well as the disadvantages of this technology for use in the connector segment.


    Stefan Raab, Harald Kraenzlein & Martin Bleicher | TE Connectivity Germany

  • Challenges with Application-relevant Miniaturization Requirements from Customers in Comparison with HV Standardization Requirements

    Subject area: Signal connector systems in the HV environment


    Description: In the context of further electrification and the associated requirements for monitoring status variables in mobile or stationary battery storage systems, there are high customer expectations for board signal connector systems that simultaneously meet the HV standard requirements and are miniaturized to the maximum for the ongoing development of higher integration of measurement and monitoring functions in battery management systems.


    In this voltage field, the standard-compliant fulfilment of tracking current and dielectric strength while simultaneously minimizing PCB space requirements and maximizing contact density with the highest robustness requirements for the contact system is a continuous challenge. 


    The article takes a closer look at the sometimes divergent customer requirements and how these can be implemented for specific applications in compliance with current standards. 


    In addition to standard applications in mobile and stationary battery storage systems, where common standardization limits are applicable, there are also special applications in which, for example, a battery pack is to be transported/used and monitored at great heights, resulting in requirements for dielectric strength over the air distance far beyond common standards.  


    Stephen Kaminski | TE Connectivity Germany

  • Design Rethinking Connectors and Housings made of Electrically Conductive Plastics

    Subject area: New surface technologies


    Description: Plastics are often superior to metal materials, particularly due to lower production costs, weight savings and sustainability (CO2, recycling, processing temperature). Despite higher compound prices, a plastic solution will become more important in the future in terms of economic efficiency and sustainability. For this reason, the Lüdenscheid Plastics Institute is working with 25 participants along the entire value chain on the issues of integration and the opportunities and hurdles of new materials as part of the 3rd joint company project. With regard to EMC, only radiated phenomena have been considered in the joint projects to date (field coupling, e.g. WLAN, Bluetooth, which can penetrate a housing via the air). In many areas, however, this only reflects the real application to a limited extent, as currents and electromagnetic fields are introduced into the enclosure via cables, e.g. HV distributors. It is necessary to evaluate which influencing factors affect the enclosure with regard to cable routing and how electrical cable connections must be realized in comparison to metal enclosures. The lecture deals with the topic of new materials and their potential in EMC applications. The challenges in the design of enclosures made of conductive plastics compared to metallic materials will be reflected.


    Marius Fedler | Kunststoffinstitut Lüdenscheid

  • RoProxCon - A new approach to connectors!

    Description: Hundreds of mating cycles take place every day between a robot arm and a changing tool. This has an impact on the service life of the connectors. The contactless solution offers extended functionalities, especially in situations where a wired connection is problematic or impossible.


    Johannes Winkler | Rosenberger Hochfrequenztechnik GmbH & Co. KG 

  • Continuous electroplating systems with greener technology for electronic components

    Describtion: The market demands ever shorter reaction times, higher quality and lower prices in order to remain competitive. Our task is to produce processes in surface technology using efficient and environmentally friendly technologies.  Environmental friendliness, especially in electroplating technology, also plays a major role in health, corporate image and sales strategy. In order to meet these requirements and to keep up with the constantly growing competition, the automation of companies is of the utmost importance for their current and future competitiveness. 


    Customizable modules that describe electroplating processes help to increase process transparency. In just a few steps, environmental and production figures can be calculated according to customer orders and electrolyte additions can be determined and controlled. 


    Sophisticated automation keeps quality constant, visualizes complex processes, digitizes project management, performs product-specific refinement, analyses, digitizes quality management and integrates many other activities that take place before or after.


    Examples such as increasing your plant productivity, digital production indicators, batch tracking, quality assurance, production safety, fault diagnosis, remote maintenance support are standard in every control system today. 


    The automation for every factory that is integrated with galvanic expertise, we have linked the plant control with quality features, sensors, cameras, robotics and the corresponding department. 


    With today's 3D printing technology, selective processes for refining processes such as nickel, tin, silver and gold can be produced in a few days, cost-effectively and in an environmentally friendly manner. 


    Thus, with sophisticated automation and environmentally friendly process technologies, greener manufacturing is produced. 


    This presentation is intended to educate the audience about the importance of transferring production expertise to automation and environmentally friendly technology in order to keep up with the competition and make one's own company transparent. To what economic extent an implementation is initially recommended and what effort is involved.


    Ilhan Körbulak | OTMK GmbH

from 6:30 pm

Poster Slam Award Ceremony and Get Together at the VCC Vogel Convention Center

We end the day with finger food, cool drinks and plenty of time to network with participants, speakers and exhibitors.

sponsored by

Tuesday, June 4th, 2024 - User Congress Day 1

(Event hall "Shedhalle")

9:00 - 9:10 am

Welcome to the first day at the connector user conference

Listen to lectures from experts on the following topics:

  • Single Pair Ethernet / Ethernet
  • New solutions in connection technology
  • Approval and testing
  • Plastics
  • Best practices

Kristin Rinortner | ELEKTRONIKPRAXIS

09:10 - 09:40 am

Keynote

Smart Factory – what comes after industry 4.0?

  • Description

    Current trends in networked production with regard to the sustainability and role of AI.


Prof. Dr.-Ing. Martin Ruskowski | Technologie-Initiative Smart Factory KL e.V.

9:40 - 10:10 am

Challenges in SPE Implementation - The reasons why it takes longer

Focus: Single Pair Ethernet (SPE)

  • Description

    In recent years, a lot has been presented and discussed about the new technological developments in the field of SPE. With the IEEE standards of the 802.3 series, connectors of the IEC 63171 standard series and the associated cables of 61156-11...14, the market is offered a broad normative solution. This broad normative solution is already being implemented in various devices and components. This is the first reason why implementation is slower than some expected. The wide range of available solutions makes it difficult to make a decision for fear of making the wrong choice. In addition, one of the most important communicated benefits - cost savings - is not visible immediately, but only in the future. This means that communicated advantages are countered by disadvantages. Other points are the necessity of introducing SPE at this point in time. Never change a running system... Why should a functioning future-oriented automation system with up to 10Gbit/s (in use today) be replaced without a direct necessity or a visible benefit? The key is "brownfield" integration. Even with IIot or I4.0, the misconception was made that it is always a "greenfield" environment.

Manuel Rueter | TE Connectivity Industrial GmbH

10:10 - 10:40 am

Tested PCB Terminals and Connectors for Ethernet, EtherCAT and SPE

Focus: SPE / Ethernet

  • Description

    In the networking of industrial and building automation, Ethernet does not stop at the field level. Where fieldbus systems dominated in the past, Ethernet-capable end devices are increasingly being used today and will continue to do so in the future. This also poses particular challenges for PCB connection technology. The connectors and terminals that were designed for a few Kbit/s are now being used for up to 1000 Mbit/s applications. 


    In this presentation, simulation and measurement results will be used to show the extent to which conventional connection technology is still suitable for the Ethernet connection of sensors and field devices. The influence of correct assignment and the effect of cable routing and shielding on data transmission will be discussed. In particular, the attenuation and reflection behavior will be considered and the effects of near-end crosstalk will also be discussed and solutions shown on how to get such effects under control in practice.


    Co-Speaker:


    Jonas Weirauch | PHOENIX CONTACT GmbH & Co. KG

Andy Schaefer | PHOENIX CONTACT GmbH & Co. KG

10:40 - 11:10 am

Coffee Break and Exhibition

11:10 - 11:40 am

From Press-fit Technology to the Connectors of the Future

Focus: New Solutions in Connection Technology / Press-in Technology

  • Description

    A time travel of a connector with press-fit technology for Industry&Communication has developed into a long-lasting solution for Automotive, which now seems to be over again. Or does it? Today's connectors have to keep pace with key trends such as miniaturization and digitalization, with buzzwords such as lead avoidance and sustainability influencing the design of these components. 


    Hermann Eicher makes technological reference to current changes and uses them to form insights for a connector of the future - always under the premise of safety, data transmission and shielding. Whatever will determine the design for future requirements of a hybrid-functional, modular connector: Development remains creative with both optical and RF-oriented technologies, as advances in materials science and manufacturing technology are making connectors possible that ept can already imagine today.

11:40 - 12:10 am

Fast Direct Connection Technology for PCB Terminals and Connectors

Focus: New Solutions in Connection Technology / Connection Technology

  • Description

    Time and efficiency are of crucial importance in an electrified and digitalized society. This is why conductor connection technology for PCB terminal blocks and connectors must continue to evolve. The focus here is on optimizing the push-in spring connection to a tool-free direct connection technology. Compared to other connection technologies, this reduces assembly times and opens the way paves the way for fast, fully automated wiring. At the heart of this technology is a pre-tensioned contact spring that enables the connection of rigid and flexible conductors with and without ferrules. Due to these requirements, new technologies and innovations are needed. In this presentation, the innovative technological possibilities developed will be demonstrated and explained.

Lucas Laessig | Phoenix Contact GmbH & Co. KG

12:10 - 12:40 am

Discussion of the Evaluation Standard for Soldering Tests with Lead-free Solder on Copper and Copper Alloy Strip

Focus: Approval and Testing

  • Description

    After DIN 32506 was deleted without replacement in 2017, there is no longer a standardized soldering test for strips made of copper and copper alloys. In the absence of an alternative, DIN EN IEC 60068-2-20 is therefore often applied to strip materials in practice. applied to strip materials. This standard describes soldering tests with lead-free and lead-containing solder on connections coming out of components.


    It is possible to carry out soldering tests on strip samples in accordance with the standard, but this requires a discussion of the evaluation standard used to assess the samples.


    The article describes the sometimes very different soldering results that arise when a strip sample is tested with leaded or lead-free solder in accordance with standards. It also discusses the dependence of the soldering result on the material composition, the strip thickness and the surface condition. 


    The information obtained from a wide range of tests enables a discussion of how results from soldering tests with lead-free solder can be interpreted in comparison to the usual tests with leaded solder. can be interpreted.


    Co-speakers:


    Julian Guter & Dr.-Ing. Robert Zauter | Wieland Werke

Peter Stahl | Wieland- Werke

12:40 am - 1:50 pm

Lunch Break and Exhibition

1:50 - 2:50 pm

Parallel Workshops

(VCC Seminar Rooms)

Workshop 1: Leak Testing of Connectors in the Production Process

Focus: Testing & Inspection

  • Description

    Current market-dominating trends such as the energy transition, e-mobility and medical technology are associated with new requirements for the products used. This also applies to connectors.


    In the field of electromobility, connectors must meet the special requirements for use in charging infrastructure, power control and thermal management. 

    In the renewable energy segment, they are often used outdoors for power distribution, signal lines and the control of wind power and photovoltaic systems.


    Reliable and trouble-free operation is essential for medical technology applications. There are also innovative developments such as multifunctional connectors and intelligent connectors with integrated electronics. 


    To reduce risks and ensure quality, they are also tested for tightness against moisture and liquids.


    In the IP protection class test, prototypes are tested in the laboratory in accordance with the required IP protection class. This is a type test.


    If there is a requirement to deliver every product tested, a routine test is necessary. For this purpose, the leak test is integrated into the production process as an end-of-line test.


    Depending on the condition of the connector and whether it is installed as an individual product, as a plugged-in unit or in a system, there are different requirements for the technical design of the leak test in the production process.


    Some connectors do not even have to be leak-tight in the area of the male connector, but only the mated unit consisting of the connector and mating connector. Sometimes a through-hole is specifically provided in the connector to allow the entire system to be vented when installed. And the system can be tested via this during the leak test.


    The condition of the connector (tight or leaking in the area of the male connector) and whether it is to be tested as a single product or as a plugged-in unit with mating connector or installed in a housing has an impact on the design of the leak test process and the type of adaptation.


    Based on the basics of leak testing, this workshop presents a practical guide for leak testing different types of connectors. This is supplemented by a variety of practical tips for the practical implementation of the leak test. 


    You will learn:


    • IP protection types for water testing / type testing versus routine testing
    • Leak testing with compressed air during production / Adaptation of connectors
    • Practical examples / practical tips / FAQ

Dr. Joachim Lapsien | CETA Testsysteme

Workshop 2: Measuring System Analysis to Optimize Quality Controls using X-ray Fluorescence Analysis (XRF)

Focus: Testing & Inspection

  • Description

    Modern production is characterized by high quality standards and high throughput. It is not only necessary to optimize the production processes in terms of quality and throughput, but also the testing and measuring processes. Measurement system analysis (MSA) provides valuable information and indications of possible optimization measures for testing and measurement technology. As MSA is often requested and carried out anyway, recommendations for further optimization can be derived without additional effort. However, this also requires an understanding of the interrelationships, which we would like to shed some light on here. 


    For a better understanding, we will first go into the relevant basics of statistics and measurement system analysis. Influencing factors for the measurements with the X-ray fluorescence analyzer are discussed and the connection with the MSA is established. Accuracy and scattering can be considered individually for an XRF measuring device. This results in relevant conclusions for optimization. 


    The aim of the workshop is to enable you to carry out the optimization shown on your measuring device.

Dr. Konstantinos Panos | Helmut Fischer

Workshop 3: EMC-compliant Design and EMC-compliant Use of Connectors

Focus: EMC

  • Description

    Connectors are also critical components in all electronic devices and systems in terms of EMC. EMC is determined by several sources of interference and electromagnetic coupling. These interference sources and couplings are explained using practical examples. The design and correct use of connectors play an important role in the EMC-compliant design of devices and systems. These two aspects will be demonstrated in the workshop using current connector designs. Even with a connector that is optimized in terms of EMC, EMC interference can be generated if the user makes an unfavorable connection. In the workshop, EMC rules for selecting the right connectors and the right connections to the PCB and cable are presented.

Dr.-Ing. Helmut Katzier | Engineering office for construction and connection technology

Workshop 4: Market Trend: Maximum Flexibility

Focus: Modular PCB Connectors

  • Description

    The presentation "Market trend: Maximum flexibility" is intended to provide an insight into the current trend developments in the field of modular connectivity. Thematically, the focus will be on miniaturization & modularization between already known solutions and current market developments. The content covered in the presentation will range from the advantages of existing solutions to new approaches and concepts for driving forward modularization and miniaturization.


    The presentation will start with a review of the current market-known modular industrial connectors and the advantages that result from the existing solutions. It will also provide an insight into what developments the market will demand in the future.


    After this section has been completed, an innovative approach will be presented on how modular connectors can also be implemented in currently untapped applications & target markets.


    The third part presents a modular and flexible approach to field cabling in order to implement cabling options precisely, safely and efficiently. Particular emphasis is placed on future-proof wiring, which saves the user time and money thanks to the interchangeable plug-in face.


    The presentation offers all listeners a unique opportunity to experience the latest developments in the field of modular connectivity in a practical way.

Bennet Winkelmann | Harting Germany

Workshop 5: Challenges in the Design of Impedance-optimized Circuit Boards with regard to Material Selection and Interfaces to Signal-carrying Connectors

Focus: High-speed Board-to-Board Connectors

  • Description

    For PCBs that transmit high-frequency data signals, the design and choice of materials play a function-determining role. The same applies to the connectors installed on the PCBs. connectors installed on the PCBs. Board-to-board connectors are considered here as an example.


    The workshop deals with the correct approach to the design of corresponding PCBs at different frequency levels. Material and layout (conductor geometry and via topology) and other cost-driving elements will be discussed. Aspects such as pin assignment and EMC shielding are also considered when designing the board-to-board connectors.

Workshop 6: The use of Additive Manufacturing Micro & Ceramic DLP in service of the electronics industry

Focus: Additive Manufacturing

  • Description

    In this presentation we will show how additive manufacturing (AM) or 3D printing with Micro DLP and Ceramic DLP technologies can serve the electronics industry in general and more specifically connectors. 


    We will review some of the advantages and progress of these technologies in recent years and share the variety of materials that can be used with these technologies. We will demonstrate the fit of these technologies in a variety of ways, allowing engineers to develop and make complex parts that most probably can’t be made in any other way as well as use these technologies for prototyping and small batches – shortening time to market and reducing cost of development processes. 


    We will then share some exciting examples of relevant applications, such as micro connectors, micro connector core for fiber optics. As well as applications made of technical ceramics such as Alumina & Zirconia such as wire guide and dielectric ceramics components used in electronic applications at ultra-high frequency (UHF) bands.

Jasmin Zeyn | Nano Dimension

2:50 - 3:10 pm

Short Coffee Break and Exhibition

3:10 - 3:40 pm

Use of Plastics in Electronics using the Example of Connectors

Focus: Plastics

  • Description

    Connectors are workhorses: they have to be resilient and able to withstand harsh environments, while at the same time ensuring a reliable flow of data and power. The right composition of suitable contact materials and plastics is essential in order to provide a reliable connector.


    Various test and inspection methods ensure the suitability of the plastic for the respective requirement. The presentation is dedicated to the most important test methods for connectors - above all flammability tests. In general, heat development is also a problem with connectors. In view of this, according to the IEC-603355-1 standard, the insulating materials used in connectors and cables must also pass a glow wire test. The presentation will be rounded off with case studies as well as tips and tricks.

Stephan Bächle | Würth Elektronik eiSos GmbH & Co. KG

3:40 - 4:10 pm

Plastics in Industrial LVDC Networks – Aging and Plastic-metal Interaction Effects

Focus: Plastics

  • Description

    With increasing market shares of renewable energies, the need for energy storage and sustainability aspects such as energy and material efficiency, low-voltage direct current systems are highly interesting for use in sustainable factories. Here, a direct energy exchange with fewer components and losses is expected, while higher shares of renewable energies can be used with reduced peak power.


    Typical polymeric housing materials used in E&E applications have often been specifically developed and investigated for AC applications. When using DC voltages up to 1000 V, the effects on plastics can be different than in AC applications due to the lack of periodic changes in the field. Polarization processes, field peaks, migration effects etc. can influence the long-term behaviour of the plastics and the plastic-metal interaction properties.


    As part of the DC-INDUSTRIE2 project, the long-term thermal-electrical behavior of typical thermoplastic E&E insulation materials was investigated with regard to mechanical, electrical and material properties. In addition, metal-plastic interaction effects under LVDC stress in humid climate were investigated for the same insulation materials and typical contact materials. The article summarizes the various observations and results, shows limitations and possibilities and documents the need for further investigations for polymeric insulation materials in LVDC applications.

Marcel Mainka | Weidmüller Interface GmbH & Co. KG

4:10 - 4:40 pm

Coffee Break and Exhibition

4:40 - 5:10 pm

Layout Recommendation for Safe THR Soldering

Focus: Best Practice / Soldering

  • Description

    This seminar starts with the basics of the THR process. Among other things, it covers the basic requirements for component design in relation to the reflow process. This essentially includes material selection, dimensioning of component connections and housing shapes/contours. In addition, we are also confronted with the question: "Is a THR component really more expensive if the entire process is taken into account?" and look at the cost composition of the component in comparison to the resulting changes in process costs. The speakers will also provide insights into layout and stencil design. What added value does Würth ELektronik offer its customers in terms of THR processing?


    Co-speaker:


    Markus Hildmann | Würth Elektronik eiSos

Fabian Altenbrunn | Würth Elektronik eiSos GmbH & Co. KG

5:10 - 5:40 pm

Challenges and Solutions in the Application of Connector Greases

Focus: Best Practice / Plug Greases

  • Description

    Lubricants are essential design elements for reliable, long-lasting connectors. They prevent corrosion, reduce wear, dampen vibrations and seal the surfaces against environmental influences such as moisture and chemicals. An often neglected selection factor is the question of how the lubricant is applied to the contact. Challenges here include: 


    • Contamination risk: Contaminated or heavily corroded contacts wear out more quickly due to dirt and rust particles.
    • Consistency of the lubricant: In general, a distinction is made between oils, greases and dispersions. Each type of lubricant has its own application requirements.
    • Dosage: If the lubricant is overdosed, it can build up a permanently insulating layer between the contacts or swell out and reach unwanted areas. If the lubricant is underdosed, it cannot adequately fulfill its function.
    • Component complexity: The geometry and size of the connector can make application more difficult.
    • Production process: The lubricant must be integrated as easily as possible into the various production processes: From fully automated, continuous production on the assembly line to manual relubrication in the aftermarket.
    • Process reliability: As few rejects as possible - the lubricant should also contribute to this. It is therefore also crucial how repeatable and reliable the application process is.
    • Container: The lubricant must be available for purchase in a container that is suitable for the desired application method.

    In addition to the correct application technology, the lubricant itself also contributes to the ideal application. Ideally, the application should already be taken into account when selecting the lubricant: An oil, for example, should not be selected if the component to be lubricated is not thoroughly sealed to prevent oil migration. Greases adhere much better in place than oils, but cannot be dripped into very small components, for example. If neither oils nor greases are an option due to complex geometries or fully automated processes, dispersions are used: these can be sprayed on, for example. After drying, a wafer-thin layer of lubricant remains, which is usually barely noticeable. Last but not least, the container must also be suitable for the application technique.


    Attend the FUCHS presentation to find out about the various options and the influence of the lubricant as well as the possibilities and limitations!

Kim Ibrahim | Fuchs Lubricant

5:40 - 6:10

Best Practices in Stationary Battery Storage Wiring

Focus: Best Practice / Battery Storage Wiring

  • Description

    Battery storage systems are an important component for the integration of renewable energies, grid stability and security of supply. However, the wiring of battery storage systems requires special attention to ensure safety, efficiency and reliability. In this presentation, some best practices for the internal and external power, data and signal connection technology of battery storage systems will be presented.


    Practical examples will be used to show how optimal wiring of battery storage systems can be achieved, taking into account both technical requirements and economic aspects. The challenges and solutions for various application scenarios, such as home or commercial storage systems, will also be discussed.

Alexander Stammen | PHOENIX CONTACT GmbH & Co. KG

6:10 - 6:15

Summary and Information about the Evening Event

Kristin Rinortner | ELEKTRONIKPRAXIS

from 7:30

Evening Event in the Bürgerspital Würzburg Weinstuben

Wednesday, June 5th, 2024 - User Congress Day 2

(Event hall "Shedhalle")

9:00 - 9:10 am

Welcome to the Second Day at the User Congress Connectors

Listen to lectures from experts on the following topics:

  • New surface technologies (e-mobility)
  • Manufacturing
  • Additive anufacturing

Kristin Rinortner | ELEKTRONIKPRAXIS

09:10 - 09:40 am

Thermal Simulation Combined with a New Surface – The Design of a New Contact System for Electromobility

Focus: New Surface Technologies (E-mobility)

  • Description

    The new SCON contact family has been specially developed for power transmission in the driveline and charging path of electric vehicles. The contact system was designed using thermal simulations and realized in combination with a new contact surface.


    Application-oriented thermosimulation makes it possible to expose the electrical plug contacts to high thermal loads and at the same time ensure optimal functionality. This ensures greater efficiency and a longer service life of the plug contacts.


    The use of the new surface Green Silver offers a low coefficient of friction and is designed for higher ambient temperatures (180 ° C). This leads to greater reliability of the plug contacts. In addition, the use of near net shape production helps to reduce raw material consumption and improve the sustainability of the SCON Terminal System.

Stefan Masak | TE Connectivity Germany

09:40 - 10:10 am

Development of Electrical Contacts in E-mobility – Requirements for the Cleanliness of Prototypes in the Ultrasonic Welding Process

Focus: New Surface Technologies (E-mobility)

  • Description

    The electrification of the automotive sector is seen as a catalyst for new design and product solutions on the market. The increased number of competitors in the OEM supplier industry and the shortened product development cycles have an impact on plug contact prototypes. They must be available promptly and with a high level of functionality. This requires more efficient practices in the development and engineering of plug contacts.


    When connecting cables to plug contacts using ultrasonic welding, the welding process results in cleanliness requirements from the very first sample batch. Accordingly, prototypes that are as close to series production as possible are required at a very early stage in the development process.


    This presentation deals with the discrepancy between the wishes and reality of prototypes in the field of automotive high-voltage plug contacts. In particular, the cleanliness for the process design of ultrasonic welding will be discussed. In detail, an examination of various cleaning processes will serve to illustrate the development process.

Sebastian Haas | TE Connectivity Germany GmbH

10:10 - 10:40 am

Silver-graphite Dispersion Layers – Long-lasting Solution for Connectors with Exceptional Tribological Properties

Focus: New Surface Technologies (E-mobility)

  • Description

    Even with a graphite content of around 1% by weight, significant improvements in friction coefficients and electrical resistance can be achieved after loading compared to pure silver coatings. This finding is not new! In order to fully exploit the potential of electromobility, the question currently arises as to whether this type of coating can also meet current and future requirements in terms of temperature stability and number of mating cycles. The requirements vary depending on the area of application; connectors in the engine compartment are exposed to a temperature load of 180 °C, while temperatures of 150 °C are required in the charging socket area.


    The lecture will present initial measurement results using a newly developed test rig and new test concepts for tribological and electrical properties of contact layers. In addition to friction coefficients, electrical resistances can be determined in situ. The number of mating cycles and the normal force can be varied in order to simulate even very demanding requirements on contact surfaces. Furthermore, a solution approach for the application of silver coatings at higher temperatures and exceptional tribological properties will be demonstrated.

Vera Lipp | Max Schlötter GmbH & Co. KG

10:40 - 11:10 am

Coffee Break and Exhibition

11:10 - 11:40 am

CuZn Alloys for Use as Connectors - From Classic Standard Machining Brass to Lead-free New Developments

Focus: Manufacturing

  • Description

    As a semi-finished product plant, we supply customers in the connector industry with suitable primary materials made from CuZn alloys. In addition to the tried and tested lead-containing cutting blades, we also have lead-free special alloys in our repertoire. The use of lead-containing alloys, which are very popular with machining companies due to their good machining properties, is limited by EU regulations. Among other things, lead is classified as toxic to reproduction and is therefore on the REACH candidate list. In addition, the RoHS Directive aims to reduce the permissible lead content of materials even more stringently in future. As lead as an element in copper alloys acts as a chip breaker, this presents certain hurdles for machining companies. A new lead-free alloy "eZeebrass" developed by Diehl can be machined in the same way as the standard leaded brasses used to date. This alloy is an economically attractive substitute for conventional CuZn alloys.


    Co-speaker:


    Andreas Glauber | Diehl Brass Solutions

Florian Seuss | Diehl Brass Solutions

11:40 - 12:10 am

Adapted Data Acquisition and Processing Systems for the Reliable and Economical Mass Production of Lead-free Circular Connectors

Focus: Manufacturing

  • Description

    The machining mass production of circular connectors requires high process reliability and process stability, which will be significantly reduced by the imminent complete substitution of lead-containing copper-based alloys with lead-free ones. The reasons for this are increasing process forces, insufficient chip breaking and increased tool wear. This is accompanied by drastically reduced process windows in the process design. At the same time, the susceptibility of the manufacturing process to disturbance variables such as batch fluctuations in material and tools increases significantly, which ultimately leads to increased machine downtimes and complex process control.


    In order to increase process stability and simultaneously reduce machine downtimes in the mass production of lead-free connectors, solutions for monitoring and controlling the manufacturing process are therefore increasingly necessary in addition to intensive process optimization. A central aspect is the integration of Industry 4.0 technologies as well as process data acquisition systems (PDE) and process data processing systems (PDV), which enable the acquisition and analysis of production data in real time and contribute to the comprehensive networking and automation of manufacturing processes.By recording and analyzing production data in real time, errors can be detected and rectified at an early stage, which leads to a significant reduction in rejects and quality defects.


    The presentation will examine in detail the technological requirements and the potential of process data acquisition and process data processing systems for the mass production of lead-free circular connectors. To this end, an online process data monitoring and processing system developed as part of the Copper Processing Innovation Network (IKB) for machining circular connector production will first be presented. Finally, the requirements and potential for using the system in industrial mass production will be discussed.


    Co-speakers:


    Kilian Brans & Sascha Kamps | RWTH Aachen University


    Prof. Thomas Bergs | Fraunhofer Institute for Production Technology IPT

Markus Meurer |
MTI – Manufacturing Technology Institute

RWTH Aachen University

12:10 - 12:40 am

Metal Ultrasonic Welding of Plug Contacts

Focus: Manufacturing

  • Description

    The electrification of the drivetrain and the associated HV vehicle electrical system leads to increased demands on the connectors, particularly at the cable/plug contact interface. The main requirement here is the lowest possible contact resistance with high mechanical strength and a small installation space. In the course of increasing efficiency by reducing weight, flexible stranded aluminum cables and rigid aluminum busbars are increasingly finding their way into the HV vehicle electrical system.


    Due to its good suitability for joining soft copper and aluminum alloys and their mixed joints, ultrasonic metal welding is ideally suited to meeting these increased demands on a connector.


    The first part of the presentation deals with ultrasonic metal welding in general and addresses the specific challenges in the automotive sector. The second part describes the necessary steps in the development process for ultrasonic welding contacts: From robust contact design to welding process optimization and validation.

Marcel Baltes | TE Connectivity Germany GmbH

12:40 am - 1:50 pm

Lunch Break and Exhibition

1:50 - 2:50 pm

Parallel Workshops

(VCC Seminar Rooms)

Workshop 1: Leak Testing of Connectors in the Production Process

Focus: Testing & Inspection

  • Description

    Current market-dominating trends such as the energy transition, e-mobility and medical technology are associated with new requirements for the products used. This also applies to connectors.


    In the field of electromobility, connectors must meet the special requirements for use in charging infrastructure, power control and thermal management. 

    In the renewable energy segment, they are often used outdoors for power distribution, signal lines and the control of wind power and photovoltaic systems.


    Reliable and trouble-free operation is essential for medical technology applications. There are also innovative developments such as multifunctional connectors and intelligent connectors with integrated electronics. 


    To reduce risks and ensure quality, they are also tested for tightness against moisture and liquids.


    In the IP protection class test, prototypes are tested in the laboratory in accordance with the required IP protection class. This is a type test.


    If there is a requirement to deliver every product tested, a routine test is necessary. For this purpose, the leak test is integrated into the production process as an end-of-line test.


    Depending on the condition of the connector and whether it is installed as an individual product, as a plugged-in unit or in a system, there are different requirements for the technical design of the leak test in the production process.


    Some connectors do not even have to be leak-tight in the area of the male connector, but only the mated unit consisting of the connector and mating connector. Sometimes a through-hole is specifically provided in the connector to allow the entire system to be vented when installed. And the system can be tested via this during the leak test.


    The condition of the connector (tight or leaking in the area of the male connector) and whether it is to be tested as a single product or as a plugged-in unit with mating connector or installed in a housing has an impact on the design of the leak test process and the type of adaptation.


    Based on the basics of leak testing, this workshop presents a practical guide for leak testing different types of connectors. This is supplemented by a variety of practical tips for the practical implementation of the leak test. 


    You will learn:


    • IP protection types for water testing / type testing versus routine testing
    • Leak testing with compressed air during production / Adaptation of connectors
    • Practical examples / practical tips / FAQ

Dr. Joachim Lapsien | CETA Testsysteme

Workshop 2: Measuring System Analysis to Optimize Quality Controls Using X-ray Fluorescence Analysis (XRF)

Focus: Testing & Inspection

  • Description

    Modern production is characterized by high quality standards and high throughput. It is not only necessary to optimize the production processes in terms of quality and throughput, but also the testing and measuring processes. Measurement system analysis (MSA) provides valuable information and indications of possible optimization measures for testing and measurement technology. As MSA is often requested and carried out anyway, recommendations for further optimization can be derived without additional effort. However, this also requires an understanding of the interrelationships, which we would like to shed some light on here. 


    For a better understanding, we will first go into the relevant basics of statistics and measurement system analysis. Influencing factors for the measurements with the X-ray fluorescence analyzer are discussed and the connection with the MSA is established. Accuracy and scattering can be considered individually for an XRF measuring device. This results in relevant conclusions for optimization. 


    The aim of the workshop is to enable you to carry out the optimization shown on your measuring device.

Dr. Konstantinos Panos | Helmut Fischer

Workshop 3: EMC-compliant Design and EMC-compliant Use of Connectors

Focus: EMC

  • Description

    Connectors are also critical components in all electronic devices and systems in terms of EMC. EMC is determined by several sources of interference and electromagnetic coupling. These interference sources and couplings are explained using practical examples. The design and correct use of connectors play an important role in the EMC-compliant design of devices and systems. These two aspects will be demonstrated in the workshop using current connector designs. Even with a connector that is optimized in terms of EMC, EMC interference can be generated if the user makes an unfavorable connection. In the workshop, EMC rules for selecting the right connectors and the right connections to the PCB and cable are presented.

Dr.-Ing. Helmut Katzier | Engineering office for construction and connection technology

Workshop 4: Market Trend: Maximum Flexibility

Focus: Modular PCB Connectors

  • Description

    The presentation "Market trend: Maximum flexibility" is intended to provide an insight into the current trend developments in the field of modular connectivity. Thematically, the focus will be on miniaturization & modularization between already known solutions and current market developments. The content covered in the presentation will range from the advantages of existing solutions to new approaches and concepts for driving forward modularization and miniaturization.


    The presentation will start with a review of the current market-known modular industrial connectors and the advantages that result from the existing solutions. It will also provide an insight into what developments the market will demand in the future.


    After this section has been completed, an innovative approach will be presented on how modular connectors can also be implemented in currently untapped applications & target markets.


    The third part presents a modular and flexible approach to field cabling in order to implement cabling options precisely, safely and efficiently. Particular emphasis is placed on future-proof wiring, which saves the user time and money thanks to the interchangeable plug-in face.


    The presentation offers all listeners a unique opportunity to experience the latest developments in the field of modular connectivity in a practical way.

Bennet Winkelmann | Harting Germany

Workshop 5: Challenges in the Design of Impedance-optimized Circuit Boards with regard to Material Selection and Interfaces to Signal-carrying Connectors

Focus: High-speed Board-to-Board Connectors

  • Description

    For PCBs that transmit high-frequency data signals, the design and choice of materials play a function-determining role. The same applies to the connectors installed on the PCBs. connectors installed on the PCBs. Board-to-board connectors are considered here as an example.


    The workshop deals with the correct approach to the design of corresponding PCBs at different frequency levels. Material and layout (conductor geometry and via topology) and other cost-driving elements will be discussed. Aspects such as pin assignment and EMC shielding are also considered when designing the board-to-board connectors.

Workshop 6: The Use of Additive Manufacturing Micro & Ceramic DLP in Service of the Electronics Industry

Focus: Additive Manufacturing

  • Description

    In this presentation we will show how additive manufacturing (AM) or 3D printing with Micro DLP and Ceramic DLP technologies can serve the electronics industry in general and more specifically connectors. 


    We will review some of the advantages and progress of these technologies in recent years and share the variety of materials that can be used with these technologies. We will demonstrate the fit of these technologies in a variety of ways, allowing engineers to develop and make complex parts that most probably can’t be made in any other way as well as use these technologies for prototyping and small batches – shortening time to market and reducing cost of development processes. 


    We will then share some exciting examples of relevant applications, such as micro connectors, micro connector core for fiber optics. As well as applications made of technical ceramics such as Alumina & Zirconia such as wire guide and dielectric ceramics components used in electronic applications at ultra-high frequency (UHF) bands.

Stephan Krause | Nano Dimension

2:50 - 3:10 pm

Short Coffee Break and Exhibition

3:10 - 3:40 pm

Digital Series Production with Hot Lithography

Focus: Additive Manufacturing

  • Description

    Ongoing trends such as e-mobility, energy and digitalization are constantly demanding new product innovations from the electronics industry. Other discernible trends are customer-specific, individualized products and miniaturization. Miniaturization in particular is often a major challenge in the field of micro injection moulding.


    Cubicure's Caligma hot lithography system offers one way of producing these precise small components. In combination with Cubicure's flame-retardant material portfolio with V-0 ratings according to UL94 at low wall thicknesses and a CTI of 600 V, it can also be used as a final component. Tool-free production with hot lithography enables a high degree of production flexibility and design freedom. Here, additive manufacturing can score points over micro injection molding with fast and short product innovation cycles. Exemplary applications will also be presented during the presentation.

Dr. Markus Kury | Cubicure GmbH

3:40 - 4:10 pm

How to Comply with Safety Standards when 3D Printed Parts are Used for Connectors Series Production?

Focus: Additive Manufacturing

  • Description

    The use of additive manufacturing is rapidly increasing in safety critical applications. That creates new challenges because of the differences compared to traditional technologies. UL Solutions has investigated the impact of 3D printing materials processing on polymeric material properties and has developed a specific Recognition Program. The analogies and differences in Recognition of materials for traditional processing methods (Yellow Card) and for additive manufacturing (Blue Card) will be covered. 


    Then a technical insight will follow, on how the use of pre-selected Additive Materials is key for the safety compliance of 3D printed connectors series or limited production. The paper also describes the suitability of Blue Cards in three main UL safety Standards for industrial connectors employed in power and signal circuits.


    Co-speaker:


    Matteo Paleari | UL Solutions

Pawel Strzyzewski |
UL Solutions

4:10 - 4:15 pm

Summary and Outlook for 2025

Kristin Rinortner | ELEKTRONIKPRAXIS


* As of: January 31, 2024, subject to change

** Our service for participants in the basic seminars: You will receive the practical connector manual worth €89.80.

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