Speakers 2026

Alexander Butz

Fraunhofer Institute for Mechanics of Materials IWM

Stefan Hilsenbeck

LAPP Holding SE

Joachim de Buhr

Incap

Herbert Endres

EndresConsult

Sandro Fickert

LyondellBasell, LYB

Dr. Adolphe Foyet

Qnity Electronic & Industrial Finishing (ICS)

Dr. Thomas Gneiting

AdMOS GmbH

Stephan Gross

Boway Deutschland GmbH

Werner Häring

Incap

Markus Hildmann

Würth Elektronik eiSos

Alexander Hornung

Surfunction

Dr. Luca Hornung

                  Stamback

Tobias Kanne

PHOENIX CONTACT

Dr.-Ing. Helmut Katzier

Engineering office for assembly and connection technology

Dr.-Ing. Stephanie Kißling

IMO Oberflächentechnik

Markus Klingenberg

Inovan

Dr. Joachim Lapsien

CETA Test Systems

Dr. Frieder Lauxmann

Helmut Fischer

René Linde

Würth Elektronik eiSos

Bernhard Mund

bda connectivity

Andreas Nixdorf

BASF SE

Dr. Frank Ostendorf

TE Connectivity Germany

Gregor Panitz

Inventissimo

Martin Räthlein

Rosenberger

Manuel Rüter

TE Connectivity

Christoph Schnatz

ept

Stefan Sperr

MD Electronics

Alexander Spörrer

Atotech Germany

Hermann Strass

Paweł Strzyzewski

UL Solutions

Karola Tillak

Weidmüller Interface

Johannes Werning

PHOENIX CONTACT

Dr. Heinz Zenkner

Publicly appointed and sworn expert for EMC

Florian Zwintscher

Schroeder Bauer

Tim Kindermann

PHOENIX CONTACT